SMD power inductor microgate MPIH201610-R47M-LF featuring Ni-Zn ferrite core and lead free terminals
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Product Description
SMD Power Inductor - MPIH201610 Series
This specification applies to the MPIH201610 series of SMD power inductors. These components are designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Product Name: (SMD power inductor)
- Series: MPIH201610 series
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
- Environmental Compliance: Lead free products (LF).
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR Max () | Isat Max (A) | Irms Max (A) |
| MPIH201610-R24M-LF | 0.2420% | 0.032 | 3.80 | 3.70 |
| MPIH201610-R33M-LF | 0.3320% | 0.041 | 3.50 | 3.50 |
| MPIH201610-R47M-LF | 0.4720% | 0.041 | 2.35 | 2.80 |
| MPIH201610-R68M-LF | 0.6820% | 0.060 | 2.20 | 2.60 |
| MPIH201610-1R0M-LF | 1.020% | 0.072 | 1.70 | 2.00 |
| MPIH201610-2R2M-LF | 2.220% | 0.215 | 1.10 | 1.25 |
| MPIH201610-3R3M-LF | 3.320% | 0.380 | 1.00 | 0.95 |
| MPIH201610-4R7M-LF | 4.720% | 0.420 | 0.90 | 0.90 |
| MPIH201610-6R8M-LF | 6.820% | 0.660 | 0.70 | 0.70 |
| MPIH201610-100M-LF | 1020% | 0.820 | 0.60 | 0.60 |
Dimensions and Material
| Item | Material |
| Core | Ni-Zn Ferrite |
| Wire | Enameled Copper Wire |
| Terminal | Ag/Ni/Sn/Cu |
| Magnetic Glue | Epoxy resin and magnetic powder |
Dimensions (mm): A: 2.000.20, B: 1.600.20, C: 1.00Max., f: 0.600.2, g: 0.600.2, h: 0.80 Typ.
Testing Conditions
Unless otherwise specified: Temperature: 5 to 35, Humidity: 25 to 85% RH. In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Electrical Characteristics Test Conditions
- Inductance Test: 1.0MHz/1V.
- Saturation Current (Isat): Based on inductance change (|L|/L30%).
- Temperature Rise Current (Irms): Based on temperature rise (T:40 TYP).
Operating Conditions
Ambient temperature: -40 to +125.
Recommended Soldering Conditions
Suitable for flow and reflow soldering. Use rosin-based flux. Solder: Sn. For specific profile details, refer to the datasheet's soldering curves.
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Company
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Location
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Contact Person
Sellina