Microgate MPIH252012-4R7M-LF SMD power inductor suitable for power management and filtering circuits

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Product Description

Product Overview

The MPIH252012 series SMD power inductors are designed for various electronic applications. They offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.

Product Attributes

Brand: MICROGATE
Origin: Shenzhen, P.R.C.
Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
Certifications: Lead-free products (LF)

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max	DCR () Typ	Isat (A) Max	Isat (A) Typ	Irms (A) Max	Irms (A) Typ
MPIH252012-R24M-LF	0.2420%	0.026	0.022	5.40	5.80	3.80	4.00
MPIH252012-R33M-LF	0.3320%	0.030	0.025	4.95	5.05	4.95	5.25
MPIH252012-R47M-LF	0.4720%	0.032	0.027	4.20	4.50	3.40	3.75
MPIH252012-R68M-LF	0.6820%	0.045	0.037	3.50	4.00	3.20	3.50
MPIH252012-1R0M-LF	1.020%	0.056	0.045	2.60	3.00	2.70	3.50
MPIH252012-1R5M-LF	1.520%	0.072	0.060	2.10	2.30	2.10	2.25
MPIH252012-2R2M-LF	2.220%	0.100	0.085	1.60	1.90	2.08	2.20
MPIH252012-3R3M-LF	3.320%	0.144	0.120	1.50	1.70	1.50	1.60
MPIH252012-4R7M-LF	4.720%	0.216	0.180	1.25	1.40	1.20	1.35
MPIH252012-6R8M-LF	6.820%	0.300	0.250	1.10	1.20	0.95	1.05
MPIH252012-100M-LF	1020%	0.462	0.385	0.90	1.00	0.80	0.90
MPIH252012-470M-LF	4720%	2.250	1.850	0.40	0.42	0.32	0.35

Dimensions

Dimensions in mm	A	B	C	D	E	f	g	h
Value	2.500.20	2.000.20	1.20Max.	0.800.2	0.800.2	0.80 Typ.	2.50 Typ.	2.00 Typ.

Operating Conditions

Product normal work ambient temperature: -40 ~ +125.

Reliability and Test Conditions

Item	Required Characteristics	Test Method/Condition
High temperature storage test	1.No case deformation or change in appearance. 2.Inductance change 10% \|L\|/L10%	Temperature: 1252, Time: 1000 hours. Measurement after 244 hours at room temperature.
Low temperature storage test	Inductance change 10% \|L\|/L10%	Temperature: -402, Time: 1000 hours. Measurement after 244 hours at room temperature.
Humidity test	Inductance change 10% \|L\|/L10%	Temperature: 25-85, Humidity: 85% RH, Time: 1000 hours. Measurement after 244 hours at room temperature.
Thermal shock test	Inductance change 10% \|L\|/L10%	1000 cycles of -40 for 30min and 125 for 30min.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux.
Heat endurance of reflow soldering	1.No case deformation or change in appearance. 2.Inductance change 10% \|L\|/L10%	Refer to reflow curve, 3 times. Peak temperature: 260+5/-0.
Vibration test	No case deformation or change in appearance.	10~55Hz, 1.5mm amplitude, 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Drop test	No case deformation or change in appearance.	Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test	Terminal should not pull off.	Apply 17.64N force for 10s.
Loading at High Temperature	1. No case deformation or change in appearance. 2. \|L\|/L10%	Temperature: 852, Time: 1000 hours, Apply rated current. Measurement after 244 hours at room temperature.