SMD power inductor microgate MPIT6045-221M-LF with Ag Ni Sn Cu terminals and lead free certification

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Product Description

Product Overview

The MPIT6045 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.

Product Attributes

Brand: MICROGATE
Origin: SHENZHEN, P.R.C.
Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
Certifications: Lead free products (LF).

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR Max. ()	Isat Max. (A)	Irms (A)
MPIT6045-R82M-LF	0.8220%	0.011	13.00	5.75
MPIT6045-1R0M-LF	1.0020%	0.010	13.00	5.75
MPIT6045-1R2M-LF	1.2020%	0.013	11.00	5.50
MPIT6045-1R5M-LF	1.5020%	0.013	10.00	5.50
MPIT6045-1R8M-LF	1.8020%	0.016	9.50	4.85
MPIT6045-2R2M-LF	2.2020%	0.018	9.00	4.60
MPIT6045-3R0M-LF	3.0020%	0.024	8.00	4.00
MPIT6045-3R3M-LF	3.3020%	0.024	8.00	4.00
MPIT6045-3R9M-LF	3.9020%	0.025	6.20	3.90
MPIT6045-4R7M-LF	4.7020%	0.026	6.00	3.80
MPIT6045-6R8M-LF	6.8020%	0.040	5.50	3.00
MPIT6045-8R2M-LF	8.2020%	0.045	4.50	2.85
MPIT6045-100M-LF	10.020%	0.056	4.20	2.75
MPIT6045-120M-LF	12.020%	0.065	4.00	2.50
MPIT6045-150M-LF	15.020%	0.085	3.50	2.10
MPIT6045-220M-LF	22.020%	0.116	3.20	1.80
MPIT6045-330M-LF	33.020%	0.175	2.40	1.45
MPIT6045-470M-LF	47.020%	0.260	2.20	1.20
MPIT6045-560M-LF	56.020%	0.286	1.70	1.15
MPIT6045-680M-LF	68.020%	0.325	1.65	1.10
MPIT6045-820M-LF	82.020%	0.408	1.40	1.05
MPIT6045-101M-LF	10020%	0.468	1.30	1.00
MPIT6045-121M-LF	12020%	0.585	1.10	0.90
MPIT6045-151M-LF	15020%	0.740	0.95	0.80
MPIT6045-221M-LF	22020%	1.050	0.70	0.50
MPIT6045-331M-LF	33020%	1.464	0.70	0.58
MPIT6045-471M-LF	47020%	2.300	0.53	0.45
MPIT6045-102M-LF	100020%	5.650	0.40	0.30

Dimensions

Dimensions in mm	A	B	C (Max.)	D	E	f (Typ.)	g (Typ.)	h (Typ.)
6.00.3	6.00.3	4.5	2.90.3	1.550.3	2.8	6.2	5.7

Operating Conditions

Ambient Temperature: -40 ~ +125

Reliability and Test Conditions Summary

Item	Required Characteristics	Test Method/Condition
High temperature storage	No case deformation or change in appearance. \|L\|/L10%	1252, 1000 hours. Measurement after 244 hours at room temperature.
Low temperature storage	No case deformation or change in appearance. \|L\|/L10%	-402, 1000 hours. Measurement after 244 hours at room temperature.
Humidity test	No case deformation or change in appearance. \|L\|/L10%	25-85, 85% RH, 1000 hours. Measurement after 244 hours at room temperature.
Thermal shock	No case deformation or change in appearance. \|L\|/L10%	1000 cycles of -40 (30 min) to 125 (30 min).
Solderability	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 second.
Heat endurance of reflow soldering	No case deformation or change in appearance. \|L\|/L10%	3 times reflow soldering. Peak temperature: 260+5/-0.
Vibration test	No case deformation or change in appearance. \|L\|/L10%	10~55Hz, 1.5mm amplitude, 2 hours per direction, 3 directions (total 6 hours).
Drop test	No case deformation or change in appearance. \|L\|/L10%	Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test	Terminal should not pull off.	Apply 17.64N force for 10s after soldering on PCB.
Loading at High Temperature	No case deformation or change in appearance. \|L\|/L10%	852, 1000 hours, apply rated current. Measurement after 244 hours at room temperature.