Lead free SMD power inductor microgate MPIA252012-2R2M-LF engineered for electronic power regulation

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This specification applies to the MPIA252012 series of SMD power inductors. These inductors are designed for various electronic applications requiring efficient power management.

Product Attributes

Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
Origin: P.R.C.
Product Name: (SMD power inductor)
Series: MPIA252012 series
Version: Rev2.0
Environmental Compliance: Lead free products (LF)

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max	DCR () Typ	Isat (A) Max	Isat (A) Typ	Irms (A) Max	Irms (A) Typ
MPIA252012-R24M-LF	0.2420%	0.025	0.021	5.50	6.00	4.30	4.70
MPIA252012-R33M-LF	0.3320%	0.026	0.022	6.30	7.00	3.75	4.40
MPIA252012-R47M-LF	0.4720%	0.035	0.027	5.50	6.00	3.50	3.80
MPIA252012-R68M-LF	0.6820%	0.045	0.040	4.50	4.80	3.50	3.80
MPIA252012-1R0M-LF	1.020%	0.057	0.047	3.80	4.00	3.30	3.60
MPIA252012-1R5M-LF	1.520%	0.095	0.079	3.80	4.20	2.50	3.00
MPIA252012-2R2M-LF	2.220%	0.100	0.080	2.45	3.00	2.10	2.40
MPIA252012-3R3M-LF	3.320%	0.156	0.130	1.80	2.10	1.35	1.50
MPIA252012-4R7M-LF	4.720%	0.255	0.215	1.60	2.00	1.30	1.50
MPIA252012-6R8M-LF	6.820%	0.340	0.283	1.30	1.50	1.00	1.10
MPIA252012-100M-LF	1020%	0.450	0.400	1.30	1.50	0.70	0.80

Item	Appearance and dimensions (mm)	Material
Dimensions	A: 2.500.20, B: 2.000.20, C: 1.20Max., D: 0.800.2, E: 0.800.2, f: 0.80 Typ., g: 2.50 Typ., h: 2.00 Typ.
Core		Alloy Material
Wire		Enameled Copper Wire
Terminal		Ag/Ni/Sn/Cu
Magnetic Glue		Epoxy resin and magnetic powder

Test Condition	Details
Temperature	Ordinary Temperature (5 to 35)
Humidity	Ordinary Humidity (25 to 85% RH)
Doubtful Measurement Temperature	202
Doubtful Measurement Humidity	60 to 75% RH
Atmospheric Pressure	86 to 106 kPa

Working Condition	Details
Ambient Temperature	-40 ~ +125

Reliability Test	Required Characteristics	Test Method/Condition
High temperature storage test	No case deformation or change in appearance. \|L\|/L10%	Temperature: 1252, Time: 1000 hours. Measurement after 244 hours at room temperature.
Low temperature storage test	No case deformation or change in appearance. \|L\|/L10%	Temperature: -402, Time: 1000 hours. Measurement after 244 hours at room temperature.
Humidity test	No case deformation or change in appearance. \|L\|/L10%	Temperature: 25-85, Humidity: 85% RH, Time: 1000 hours. Measurement after 244 hours at room temperature.
Thermal shock test	No case deformation or change in appearance. \|L\|/L10%	-40 for 30min, then 125 for 30min, 1000 cycles.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 seconds. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux.
Heat endurance of reflow soldering	No case deformation or change in appearance. \|L\|/L10%	Refer to reflow curve, 3 times. Peak temperature: 260+5/-0.
Vibration test	No case deformation or change in appearance. \|L\|/L10%	10~55Hz, 1.5mm amplitude, 2 hours in each of 3 directions (total 6 hours).
Drop test	No case deformation or change in appearance. \|L\|/L10%	Drop 10 times on a concrete floor from 1m height.
Terminal strength push test	Terminal should not pull off.	Pulling test: 17.64N force for 10s. Bending test: 2mm deflection.
Loading at High Temperature	No case deformation or change in appearance. \|L\|/L10%	Temperature: 852, Time: 1000 hours, Apply rated current. Measurement after 244 hours at room temperature.

Soldering Condition	Details
Flux	Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%. Use Sn solder.
Flow soldering conditions	Temperature difference between product surface and solder: max 150 during pre-heating, max 100 during cooling.
Reflow soldering conditions	Profile Feature: Average Ramp-Up Rate (Ts max. to Tp): 3/second max. Preheat (Ts min. to Ts max.): 150, 60-180 seconds. Temperature (TL): 217, Time (tL): 60-150 seconds. Peak Temperature (Tp): 260, Peak Time (Tp): 3-4 seconds. Time within 5 C of actual Peak Temperature: 20-40 seconds.