SMD power inductors microgate MPIT6045-1R0M-LF with lead free certification and material construction
Product Overview
The MPIT6045 series SMD power inductors are designed for high-performance applications. They offer reliable electrical characteristics and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD. These inductors are suitable for various operating conditions and are built with quality materials.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN, P.R.C
- Series: MPIT6045 series
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder
- Certifications: Lead-free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
|---|---|---|---|---|---|---|---|
| MPIT6045-R82M-LF | 0.8220% | 0.011 | 0.008 | 13.00 | 15.00 | 5.75 | 6.35 |
| MPIT6045-1R0M-LF | 1.0020% | 0.010 | 0.008 | 13.00 | 15.00 | 5.75 | 6.35 |
| MPIT6045-1R2M-LF | 1.2020% | 0.013 | 0.010 | 11.00 | 12.50 | 5.50 | 6.05 |
| MPIT6045-1R5M-LF | 1.5020% | 0.013 | 0.010 | 10.00 | 11.50 | 5.50 | 6.05 |
| MPIT6045-1R8M-LF | 1.8020% | 0.016 | 0.012 | 9.50 | 10.50 | 4.85 | 5.60 |
| MPIT6045-2R2M-LF | 2.2020% | 0.018 | 0.014 | 9.00 | 10.50 | 4.60 | 5.00 |
| MPIT6045-3R0M-LF | 3.0020% | 0.024 | 0.018 | 8.00 | 9.00 | 4.00 | 4.40 |
| MPIT6045-3R3M-LF | 3.3020% | 0.024 | 0.018 | 8.00 | 9.00 | 4.00 | 4.40 |
| MPIT6045-3R9M-LF | 3.9020% | 0.025 | 0.021 | 6.20 | 6.80 | 3.90 | 4.30 |
| MPIT6045-4R7M-LF | 4.7020% | 0.026 | 0.020 | 6.00 | 7.50 | 3.80 | 4.20 |
| MPIT6045-6R8M-LF | 6.8020% | 0.040 | 0.031 | 5.50 | 6.20 | 3.00 | 3.30 |
| MPIT6045-8R2M-LF | 8.2020% | 0.045 | 0.038 | 4.50 | 5.00 | 2.85 | 3.15 |
| MPIT6045-100M-LF | 10.020% | 0.056 | 0.046 | 4.20 | 4.80 | 2.75 | 3.00 |
| MPIT6045-120M-LF | 12.020% | 0.065 | 0.050 | 4.00 | 4.50 | 2.50 | 2.75 |
| MPIT6045-150M-LF | 15.020% | 0.085 | 0.065 | 3.50 | 3.80 | 2.10 | 2.30 |
| MPIT6045-220M-LF | 22.020% | 0.116 | 0.089 | 3.20 | 3.50 | 1.80 | 2.00 |
| MPIT6045-330M-LF | 33.020% | 0.175 | 0.135 | 2.40 | 2.60 | 1.45 | 1.60 |
| MPIT6045-470M-LF | 47.020% | 0.260 | 0.200 | 2.20 | 2.30 | 1.20 | 1.30 |
| MPIT6045-560M-LF | 56.020% | 0.286 | 0.220 | 1.70 | 1.90 | 1.15 | 1.25 |
| MPIT6045-680M-LF | 68.020% | 0.325 | 0.250 | 1.65 | 1.80 | 1.10 | 1.20 |
| MPIT6045-820M-LF | 82.020% | 0.408 | 0.340 | 1.40 | 1.50 | 1.05 | 1.15 |
| MPIT6045-101M-LF | 10020% | 0.468 | 0.390 | 1.30 | 1.40 | 1.00 | 1.10 |
| MPIT6045-121M-LF | 12020% | 0.585 | 0.450 | 1.10 | 1.20 | 0.90 | 1.02 |
| MPIT6045-151M-LF | 15020% | 0.740 | 0.570 | 0.95 | 1.15 | 0.80 | 0.91 |
| MPIT6045-221M-LF | 22020% | 1.050 | 0.880 | 0.70 | 1.00 | 0.50 | 0.60 |
| MPIT6045-331M-LF | 33020% | 1.464 | 1.220 | 0.70 | 0.77 | 0.58 | 0.64 |
| MPIT6045-471M-LF | 47020% | 2.300 | 1.770 | 0.53 | 0.60 | 0.45 | 0.50 |
| MPIT6045-102M-LF | 100020% | 5.650 | 4.700 | 0.40 | 0.45 | 0.30 | 0.35 |
Dimensions and Material
Appearance and Dimensions (mm):
| A | B | C (Max.) | D | E | f (Typ.) | g (Typ.) | h (Typ.) |
|---|---|---|---|---|---|---|---|
| 6.00.3 | 6.00.3 | 4.5 | 2.90.3 | 1.550.3 | 2.8 | 6.2 | 5.7 |
Material List:
| Item | Material |
|---|---|
| Core | Ni-Zn Ferrite |
| Wire | Enameled Copper Wire |
| Terminal | Ag/Ni/Sn/Cu |
| Magnetic Glue | Epoxy resin and magnetic powder |
Testing Conditions
Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH
Doubt Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa
Test Instruments and Remarks
- Inductance and DCR measured by CHROMA 3302 meter.
- Current measured by CHROMA 3302 and 1320 meter.
- L test condition: 100KHz/1V.
- Isat: Based on inductance change (|LI-L|/L30%).
- Irms: Based on temperature rise (T:40 TYP).
Operating Conditions
Ambient temperature: -40 to +125
Reliability Test Conditions
High Temperature Storage: 1252 for 1000 hours. |L|/L10%.
Low Temperature Storage: -402 for 1000 hours.
Humidity Test: 25-85, 85% RH for 1000 hours.
Thermal Shock Test: 1000 cycles of -40 (30 min) to 125 (30 min).
Solderability Test: Dip pads in flux then dip in solder pot at 2455 for 50.1 seconds. 90% min. solder coverage.
Heat Endurance of Reflow Soldering: 3 reflow cycles. Peak temperature: 260+5/-0. |L|/L10%.
Vibration Test: 10~55Hz, 1.5mm amplitude for 2 hours in each of 3 directions (total 6 hours).
Drop Test: 1 meter onto concrete floor, 10 times.
Terminal Strength Test: Pulling test: 17.64N force for 10s. Bending test: 2mm deflection at PCB middle point, 0.5mm/sec speed, 601s hold time.
High Temperature Load: 852 for 1000 hours with rated current applied. |L|/L10%.
Recommended Soldering Conditions
Flux: Rosin-based flux. Avoid highly acidic flux with halide content exceeding 0.2wt%.
Solder: Use Sn solder.
Flow Soldering: Temperature difference between product surface and solder should not exceed 150 during pre-heating and 100 during cooling.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.