Electronic component Microgate MPIT3010-1R5M-LF SMD power inductor suitable for various applications

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Product Description

Product Overview

The MPIT3010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.

Product Attributes

Brand: MICROGATE
Origin: P.R.C.
Product Name: SMD power inductor
Series: MPIT3010 series
Version: Rev2.0
Environmental Compliance: Lead-free products

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max.	DCR () Typ.	Isat (A) Max.	Isat (A) Typ.	Irms (A) Max.	Irms (A) Typ.
MPIT3010-R56M-LF	0.5620%	0.048	0.040	2.50	2.80	2.00	2.15
MPIT3010-R68M-LF	0.6820%	0.048	0.040	2.30	2.50	2.00	2.15
MPIT3010-1R0M-LF	1.020%	0.066	0.055	1.95	2.15	1.75	2.00
MPIT3010-1R5M-LF	1.520%	0.078	0.065	1.50	1.65	1.55	1.70
MPIT3010-2R2M-LF	2.220%	0.096	0.080	1.20	1.35	1.40	1.55
MPIT3010-3R3M-LF	3.320%	0.145	0.120	1.10	1.20	1.15	1.25
MPIT3010-4R7M-LF	4.720%	0.222	0.185	0.95	1.10	0.95	1.05
MPIT3010-6R8M-LF	6.820%	0.330	0.275	0.75	0.85	0.65	0.70
MPIT3010-8R2M-LF	8.220%	0.348	0.290	0.70	0.80	0.70	0.80
MPIT3010-100M-LF	1020%	0.480	0.380	0.65	0.70	0.65	0.70
MPIT3010-150M-LF	1520%	0.624	0.520	0.50	0.60	0.50	0.60
MPIT3010-220M-LF	2220%	1.000	0.800	0.40	0.50	0.40	0.50
MPIT3010-330M-LF	3320%	1.200	1.000	0.30	0.40	0.30	0.40

Dimensions

Dimensions in mm	A	B	C	D	E	f	g	h
3.00.20	3.00.20	1.00Max.	1.500.2	0.750.2	1.50 Typ.	3.10 Typ.	2.70 Typ.

Materials

Item	Material
Core	Ni-Zn Ferrite
Wire	Enameled Copper Wire
Terminal Electrode	Ag/Ni/Sn/Cu
Magnetic Glue	Epoxy resin and magnetic powder

Testing Conditions

Standard Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH
Doubt Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa

Reliability and Test Conditions

High temperature storage test: 1252 for 1000 hours.
Low temperature storage test: -402 for 1000 hours.
Humidity test: 25-85, 85% RH for 1000 hours.
Thermal shock test: 1000 cycles (-40 for 30 min to 125 for 30 min).
Solderability test: Dip pads in flux then dip in solder pot at 2455 for 50.1 second.
Heat endurance of reflow soldering: 3 times reflow soldering, peak temperature: 260+5/-0.
Vibration test: 10~55Hz, 1.5mm amplitude, 2 hours per direction, 3 directions (total 6 hours).
Drop test: 1 meter height, 10 times.
Terminal strength push test: 17.64N force for 10 seconds.
Terminal strength bending test: Bend 2mm at 0.5mm/sec speed.
Loading at High Temperature: 852 for 1000 hours with rated current.

Recommended Soldering Conditions

Flux: Rosin-based flux, no strong acidic flux with halide content exceeding 0.2wt%.
Solder: Sn solder.
Flow soldering conditions: Temperature difference between product surface and solder max 150 during pre-heating, max 100 during cooling.
Reflow soldering conditions: Preheat 150 (1 minute max), Peak 260 (3-4 seconds), Ramp-Up Rate max 3/sec, Ramp-Down Rate max 6/sec.