Electronic component microgate MPIT4018-2R2M-LF SMD power inductor featuring epoxy resin and enameled copper wire

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Product Description

Product Overview

The MPIT4018 series SMD power inductors are designed for various electronic applications. This specification document details the product's construction, electrical characteristics, reliability testing, and recommended soldering conditions.

Product Attributes

Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
Product Name: SMD power inductor
Series: MPIT4018 series
Version: Rev2.0
Origin: P.R.C
Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
Environmental: Lead-free products (LF).

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max.	DCR () Typ.	Isat (A) Max.	Isat (A) Typ.	Irms (A) Max.	Irms (A) Typ.
MPIT4018-R24M-LF	0.2420%	0.016	0.012	6.50	7.00	4.60	5.00
MPIT4018-R68M-LF	0.6820%	0.025	0.021	6.00	7.00	3.80	4.15
MPIT4018-1R0M-LF	1.020%	0.030	0.025	4.55	4.85	3.40	3.80
MPIT4018-1R2M-LF	1.220%	0.030	0.025	4.20	4.80	3.40	3.80
MPIT4018-1R5M-LF	1.520%	0.036	0.030	3.90	4.25	2.95	3.20
MPIT4018-2R2M-LF	2.220%	0.048	0.040	3.15	3.40	2.60	2.90
MPIT4018-2R7M-LF	2.720%	0.060	0.050	2.70	3.00	2.20	2.50
MPIT4018-3R3M-LF	3.320%	0.060	0.050	2.70	3.00	2.20	2.50
MPIT4018-3R9M-LF	3.920%	0.078	0.065	2.60	2.80	2.00	2.20
MPIT4018-4R7M-LF	4.720%	0.078	0.065	2.10	2.30	2.00	2.20
MPIT4018-6R8M-LF	6.820%	0.108	0.090	1.70	1.85	1.70	1.90
MPIT4018-100M-LF	1020%	0.168	0.140	1.40	1.55	1.20	1.30
MPIT4018-150M-LF	1520%	0.228	0.190	1.15	1.25	1.00	1.20
MPIT4018-220M-LF	2220%	0.336	0.280	1.00	1.10	0.95	1.10
MPIT4018-330M-LF	3320%	0.480	0.400	0.80	0.90	0.75	0.85
MPIT4018-470M-LF	4720%	0.720	0.600	0.70	0.80	0.60	0.70
MPIT4018-560M-LF	5620%	0.912	0.760	0.65	0.80	0.53	0.58
MPIT4018-101M-LF	10020%	1.740	1.450	0.45	0.55	0.30	0.35
MPIT4018-221M-LF	22020%	3.600	3.000	0.30	0.34	0.21	0.23

Item	Required Characteristics	Test Method/Condition
High temperature storage test	No case deformation or change in appearance.	Temperature: 1252 Time: 1000 hours Measurement at 244 hours after test conclusion.
High temperature storage test	Inductance change 10% (\|L\|/L10%)
Low temperature storage test	No case deformation or change in appearance.	Temperature: -552 Time: 1000 hours Measurement at 244 hours after test conclusion.
Low temperature storage test	Inductance change 10% (\|L\|/L10%)
Humidity test	No case deformation or change in appearance.	Temperature: 85, Humidity: 85% RH Time: 1000 hours Measurement at 244 hours after test conclusion.
Humidity test	Inductance change 10% (\|L\|/L10%)
Thermal shock test	No case deformation or change in appearance.	-40 for 30min, then 125 for 30min. 1000 cycles.
Thermal shock test	Inductance change 10% (\|L\|/L10%)	-40 for 30min, then 125 for 30min. 1000 cycles.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%
Solderability test	No case deformation or change in appearance.
Heat endurance of reflow soldering	No case deformation or change in appearance.	Refer to reflow curve, 3 times. Peak temperature: 260+5/-0
Heat endurance of reflow soldering	Inductance change 10% (\|L\|/L10%)	Refer to reflow curve, 3 times. Peak temperature: 260+5/-0
Vibration test	No case deformation or change in appearance.	10~55Hz, 1.5mm amplitude, 2 hours per direction, 3 directions (total 6 hours).
Vibration test	Inductance change 10% (\|L\|/L10%)
Drop test	No case deformation or change in appearance.	Drop 10 times on a concrete floor from a height of 1m.
Drop test	Inductance change 10% (\|L\|/L10%)	Drop 10 times on a concrete floor from a height of 1m.
Terminal strength test	Terminal should not pull off.	Pulling test: 17.64N force for 10s. Bending test: Deflection 2mm at 0.5mm/sec speed, hold 601s.
Terminal strength test	No case deformation or change in appearance.
Loading at High Temperature	No case deformation or change in appearance.	Temperature: 852 Time: 1000 hours Apply rated current Measurement at 244 hours after test conclusion.
Loading at High Temperature	Inductance change 10% (\|L\|/L10%)