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Power inductors microgate MPIT6028-100M-LF designed for electronic systems featuring ferrite core and Sn99.7 Cu0.3 solder

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The MPIT6028-series SMD power inductors are designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.

Product Attributes

  • Brand: MICROGATE
  • Origin: Shenzhen, P.R.C.
  • Material: Ferrite Core, Enameled Copper Wire, Sn99.7-Cu0.3 Solder, Epoxy Adhesive
  • Certifications: Lead-free products

Technical Specifications

Microgate Part No.Inductance (uH)DCR (m)maxIsat (A) maxIrms (A) max
MPIT6028-0R9N-LF0.930%16.96.64.6
MPIT6028-1R5N-LF1.530%20.85.04.2
MPIT6028-2R2N-LF2.230%264.23.7
MPIT6028-3R0N-LF3.030%29.93.63.4
MPIT6028-4R7M-LF4.720%40.32.73.0
MPIT6028-6R8M-LF6.820%54.72.22.5
MPIT6028-100M-LF1020%84.51.91.9
MPIT6028-150M-LF1520%123.51.61.8
MPIT6028-220M-LF2220%175.51.31.4
MPIT6028-330M-LF3320%2861.11.1
MPIT6028-470M-LF4720%3900.950.92
MPIT6028-680M-LF6820%5460.760.77
MPIT6028-101M-LF10020%7800.620.66
ItemSpecificationsTest Method/Condition
Operating temperature range25~ +85Including temperature rise due to self-generated heat
Terminal strength-pull testTerminal shall not be loosened or rupturedA 5N. load shall be applied to both terminals in the axis direction for 60 sec.
Solderability testThe terminal shall be at least 90% covered with solder.After fluxing, Inductor shall be dipped in a melted solder bath at 2305for 5 seconds.
Resistance to solvent testThere shall be no case deformation change in appearance obliteration of marking.MIL-STD-105E
Vibration test (low frequency)1.Inductors shall be no evidence of electrical and mechanical damage.
2.Inductance shall not change more than=5%.
3.Q shall not change more than=20%
1.Amplitude:1.5mm.
2.Frequency:10~55~10Hz/min.
3.Direction:X.Y.Z.
4.Duration:2 hrs/X.Y.Z.
Shock testInductors shall be dropped 10from a height of 1m onto 3cm wooden board.
Resistance to soldering heatTemp:2605,Time:101sec
High temperature load life testThere shall be no evidence of Short or open circuiting.1. temp:852.
2. time: 100012 hours.
3. load: allowed DC current.
Humidity load life1. temp: 402.
2. R.H: 90-95%.
3. time: 100012 hours.
4. load: allowed DC current.
Temperature characteristic1. Inductors shall be no evidence of electrical and mechanical damage
2. Inductance shall not change more than5%.
3. Q shall not change more than 30%.
25~ +85
Humidity test1. Temp:402.
2. R.H:90-95%.
3. Time:962 hours.
Cold test1. Temp:-402.
2. Time:962 hours.
Thermal shock test
Dry heat test1. temp:852
2. time: 962 hours
Profile FeatureLead-Free Assembly
Average Ramp-Up Rate ( Ts max. to Tp )3C/second max.
Preheat Temperature Min (Ts min.)150
Temperature Max (Ts max.)200
Time ( ts min to ts max.)60-180 seconds
Time maintained above Temperature (TL)217
Time (tL)60-150 seconds
Peak/Classification Temperature (Tp)260
Peak/Classification Time (Tp)3-4 seconds
Time within 5 C of actual Peak Temperature (tp)20-40 seconds
Ramp-Down Rate6C/second max.
Time 25 C to Peak Temperature8 minutes max.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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