Product Overview

The MAPM series of SMD Power Inductors are designed for various electronic applications. These inductors offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.

Product Attributes

• Brand: MICROGATE
• Origin: P.R.C.
• Material: Carbonyl Iron Powder Core, Polyester-Imide Wire, Tin Covered Copper Terminal
• Certifications: Lead-Free

Technical Specifications

Recommended Soldering Conditions

Flow Soldering Conditions

Pre-heating: temperature difference between solder and product surface 150. Cooling into solvent: temperature difference 100.

Reflow Soldering Conditions

Average Ramp-Up Rate: 3/second max.
Preheat: 150 to 200, 60-180 seconds.
Time maintained above 217: 60-150 seconds.
Peak/Classification Temperature: 260, 3-4 seconds.
Time within 5C of Peak Temperature: 20-40 seconds.
Ramp-Down Rate: 6C/second max.
Time 25C to Peak Temperature: 8 minutes max.

Re-work with Soldering Iron

Pre-heating: 150, 1 minute min.
Tip temperature: 280 max.
Soldering iron output: 20W max.
End of soldering iron tip: 1mm max.
Soldering time: 3 seconds max.

Packaging

Packaging Quantities: 3000 PCS/Reel.
Peeling strength of cover tape: 0.1N to 1.3 N.

Products Storage

Storage Period: Products inspected over 6 months ago should be examined. Solderability should be checked if this period is exceeded.
Storage Conditions: Temperature: -10 ~+ 40, Humidity: Less than 80% RH, no rapid change in temperature and humidity. Avoid corrosive gases, heat shock, vibration, and direct sunlight. Store in airtight packaged condition on a palette.