SMD power inductor microgate MPIT6028-2R2M-LF with Ag Ni Sn Cu terminals and magnetic core technology
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Product Description
SMD Power Inductor - MPIT6028 Series
This specification applies to the MPIT6028 series of SMD power inductors. These inductors are designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD
- Origin: P.R.C
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder for magnetic glue.
- Certifications: Lead free product.
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () | Isat (A) | Irms (A) |
| MPIT6028-1R0M-LF | 1.020% | 0.010 | 5.75 | 5.20 |
| MPIT6028-1R5M-LF | 1.520% | 0.013 | 6.00 | 4.58 |
| MPIT6028-1R8M-LF | 1.820% | 0.016 | 5.50 | 4.10 |
| MPIT6028-2R2M-LF | 2.220% | 0.020 | 5.10 | 3.75 |
| MPIT6028-2R7M-LF | 2.720% | 0.020 | 3.80 | 3.75 |
| MPIT6028-3R3M-LF | 3.320% | 0.025 | 4.15 | 3.48 |
| MPIT6028-4R7M-LF | 4.720% | 0.030 | 3.00 | 3.08 |
| MPIT6028-5R1M-LF | 5.120% | 0.043 | 3.20 | 2.60 |
| MPIT6028-6R2M-LF | 6.220% | 0.047 | 3.05 | 2.40 |
| MPIT6028-6R8M-LF | 6.820% | 0.047 | 2.60 | 2.40 |
| MPIT6028-8R2M-LF | 8.220% | 0.055 | 2.30 | 2.25 |
| MPIT6028-9R1M-LF | 9.120% | 0.074 | 2.55 | 2.15 |
| MPIT6028-100M-LF | 1020% | 0.072 | 2.04 | 1.95 |
| MPIT6028-120M-LF | 1220% | 0.080 | 1.80 | 1.85 |
| MPIT6028-150M-LF | 1520% | 0.125 | 1.75 | 1.45 |
| MPIT6028-180M-LF | 1820% | 0.120 | 1.52 | 1.45 |
| MPIT6028-220M-LF | 2220% | 0.140 | 1.45 | 1.40 |
| MPIT6028-270M-LF | 2720% | 0.155 | 1.50 | 1.32 |
| MPIT6028-330M-LF | 3320% | 0.185 | 1.35 | 1.22 |
| MPIT6028-360M-LF | 3620% | 0.215 | 1.25 | 1.13 |
| MPIT6028-390M-LF | 3920% | 0.225 | 1.25 | 1.10 |
| MPIT6028-470M-LF | 4720% | 0.315 | 1.15 | 1.06 |
| MPIT6028-680M-LF | 6820% | 0.360 | 0.80 | 0.86 |
| MPIT6028-750M-LF | 7520% | 0.410 | 0.90 | 0.81 |
| MPIT6028-820M-LF | 8220% | 0.500 | 0.80 | 0.70 |
| MPIT6028-101M-LF | 10020% | 0.500 | 0.65 | 0.70 |
Dimensions
| Model | A | B | C | D | E |
| MPIT6028 | 6.00.3 | 6.00.3 | 2.8 Max. | 5.7Typ. | 1.6Typ. |
Operating Conditions
| Item | Condition |
| Operating temperature range | -25 ~ +120 (Including self-heating) |
| Testing Conditions (Ordinary) | Temperature: 5 to 35, Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa |
| Testing Conditions (Doubt) | Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa |
Recommended Soldering Conditions
Flow soldering conditions:
- Pre-heating: Temperature difference between solder and product surface 150 max.
- Cooling: Temperature difference into solvent after soldering 100 max.
- Standard soldering profile: Pre-heating 150, 1 minute min; Peak 350, 3 seconds max.
Reflow soldering conditions (Lead-Free Assembly):
- Average Ramp-Up Rate: 3/second max.
- Preheat: 150 to 200, 60-180 seconds.
- Time maintained above TL (217): 60-150 seconds.
- Peak/Classification Temperature (Tp): 260, 3-4 seconds.
- Time within 5C of actual Peak Temperature: 20-40 seconds.
- Ramp-Down Rate: 6C/second max.
- Time 25C to Peak Temperature: 8 minutes max.
Re-work with using the iron:
- Pre-heating: 150, 1 minute.
- Tip temperature: 350 max.
- Soldering iron output: 80W max.
- End of soldering iron tip: 1mm max.
- Soldering time: 3 seconds max.
Packaging Information
Packaging quantities: 2000 PCS/Reel.
Peeling strength of cover tape: 0.15N to 1.0N.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina