SMD power inductors microgate MPIT5040-1R0M-LF with magnetic powder glue and lead free certification
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MPIT5040 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
- Certifications: Lead-free products (LF).
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR 30% () | Saturation Current Isat (A) Max. | Temperature Rise Current Irms (A) Max. | Self-Resonant Frequency SRF (MHz) |
| MPIT5040-1R0N-LF | 1.0 30% | 0.012 | 7.35 | 4.90 | 117 |
| MPIT5040-1R5N-LF | 1.530% | 0.015 | 6.30 | 4.30 | 86 |
| MPIT5040-2R2N-LF | 2.230% | 0.019 | 4.90 | 3.80 | 50 |
| MPIT5040-2R7N-LF | 2.730% | 0.022 | 4.30 | 3.60 | 37 |
| MPIT5040-3R3N-LF | 3.3 30% | 0.024 | 3.95 | 3.40 | 32 |
| MPIT5040-3R9N-LF | 3.9 30% | 0.027 | 3.55 | 3.20 | 29 |
| MPIT5040-4R7N-LF | 4.730% | 0.030 | 3.50 | 3.00 | 28 |
| MPIT5040-6R8M-LF | 6.820% | 0.043 | 2.90 | 2.50 | 21 |
| MPIT5040-100M-LF | 1020% | 0.064 | 2.35 | 2.10 | 18 |
| MPIT5040-150M-LF | 1520% | 0.086 | 2.00 | 2.00 | 13 |
| MPIT5040-220M-LF | 2220% | 0.129 | 1.60 | 1.50 | 11 |
| MPIT5040-330M-LF | 3320% | 0.188 | 1.30 | 1.20 | 9 |
| MPIT5040-470M-LF | 4720% | 0.272 | 1.10 | 1.00 | 7 |
| MPIT5040-680M-LF | 6820% | 0.400 | 0.90 | 0.80 | 6 |
| MPIT5040-101M-LF | 10020% | 0.560 | 0.75 | 0.70 | 5 |
Dimensions
| Dimensions | A | B | C (Max.) | D | E | F (Typ.) | G (Typ.) | H (Typ.) |
| (mm) | 5.00.2 | 5.00.2 | 4.1 | 2.00.3 | 1.50.3 | 4.0 | 1.5 | 3.6 |
Operating Conditions
Product normal work ambient temperature: -40 ~ +125.
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering.
Flux and Solder:
- Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%.
- Use Sn solder.
Flow Soldering Conditions:
- Pre-heating temperature difference between solder and product surface: max 150.
- Cooling temperature difference between product surface and solvent: max 100.
Reflow Soldering Conditions:
Refer to the reflow curve. Peak temperature: 260+5/-0.
| Profile Feature | Value |
| Average Ramp-Up Rate (Ts max. to Tp) | 3/second max. |
| Preheat Temperature Min (Ts min.) | 150 |
| Preheat Temperature Max (Ts max.) | 200 |
| Preheat Time (ts min to ts max.) | 60-180 seconds |
| Temperature (TL) above 217 | 217 |
| Time (tL) above 217 | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (Tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Note: All temperatures refer to the topside of the package, measured on the package body surface.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina