SMD power inductors Microgate MPIT6045-470M-LF with epoxy resin and magnetic powder glue construction

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Product Description

Product Overview

The MPIT6045 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.

Product Attributes

Brand: Microgate
Origin: Shenzhen, P.R.C.
Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
Certifications: Lead-free products (LF)

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max.	DCR () Typ.	Isat (A) Max.	Isat (A) Typ.	Irms (A) Max.	Irms (A) Typ.
MPIT6045-R82M-LF	0.8220%	0.011	0.008	13.00	15.00	5.75	6.35
MPIT6045-1R0M-LF	1.0020%	0.010	0.008	13.00	15.00	5.75	6.35
MPIT6045-1R2M-LF	1.2020%	0.013	0.010	11.00	12.50	5.50	6.05
MPIT6045-1R5M-LF	1.5020%	0.013	0.010	10.00	11.50	5.50	6.05
MPIT6045-1R8M-LF	1.8020%	0.016	0.012	9.50	10.50	4.85	5.60
MPIT6045-2R2M-LF	2.2020%	0.018	0.014	9.00	10.50	4.60	5.00
MPIT6045-3R0M-LF	3.0020%	0.024	0.018	8.00	9.00	4.00	4.40
MPIT6045-3R3M-LF	3.3020%	0.024	0.018	8.00	9.00	4.00	4.40
MPIT6045-3R9M-LF	3.9020%	0.025	0.021	6.20	6.80	3.90	4.30
MPIT6045-4R7M-LF	4.7020%	0.026	0.020	6.00	7.50	3.80	4.20
MPIT6045-6R8M-LF	6.8020%	0.040	0.031	5.50	6.20	3.00	3.30
MPIT6045-8R2M-LF	8.2020%	0.045	0.038	4.50	5.00	2.85	3.15
MPIT6045-100M-LF	10.020%	0.056	0.046	4.20	4.80	2.75	3.00
MPIT6045-120M-LF	12.020%	0.065	0.050	4.00	4.50	2.50	2.75
MPIT6045-150M-LF	15.020%	0.085	0.065	3.50	3.80	2.10	2.30
MPIT6045-220M-LF	22.020%	0.116	0.089	3.20	3.50	1.80	2.00
MPIT6045-330M-LF	33.020%	0.175	0.135	2.40	2.60	1.45	1.60
MPIT6045-470M-LF	47.020%	0.260	0.200	2.20	2.30	1.20	1.30
MPIT6045-560M-LF	56.020%	0.286	0.220	1.70	1.90	1.15	1.25
MPIT6045-680M-LF	68.020%	0.325	0.250	1.65	1.80	1.10	1.20
MPIT6045-820M-LF	82.020%	0.408	0.340	1.40	1.50	1.05	1.15
MPIT6045-101M-LF	10020%	0.468	0.390	1.30	1.40	1.00	1.10
MPIT6045-121M-LF	12020%	0.585	0.450	1.10	1.20	0.90	1.02
MPIT6045-151M-LF	15020%	0.740	0.570	0.95	1.15	0.80	0.91
MPIT6045-221M-LF	22020%	1.050	0.880	0.70	1.00	0.50	0.60
MPIT6045-331M-LF	33020%	1.464	1.220	0.70	0.77	0.58	0.64
MPIT6045-471M-LF	47020%	2.300	1.770	0.53	0.60	0.45	0.50
MPIT6045-102M-LF	100020%	5.650	4.700	0.40	0.45	0.30	0.35

Item	Required Characteristics	Test Method/Condition
High temperature storage test	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Temperature: 1252 Time: 1000 hours Measurement at 244 hours after test conclusion.
Low temperature storage test	Inductance change 10% (\|L\|/L10%)	Temperature: -402 Time: 1000 hours Measurement at 244 hours after test conclusion.
Humidity test	Inductance change 10% (\|L\|/L10%)	Temperature: 25-85, Humidity: 85% RH Time: 1000 hours Measurement at 244 hours after test conclusion.
Thermal shock test	Inductance change 10% (\|L\|/L10%)	-40 for 30 min. to 125 for 30 min. as 1 cycle. Go through 1000 cycles.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%
Heat endurance of reflow soldering	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Refer to reflow curve, 3 times. Peak temperature: 260+5/-0.
Vibration test	No case deformation or change in appearance.	Amplitude: 10~55Hz, 1.5mm, 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Drop test	No case deformation or change in appearance.	Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test	Terminal should not pull off.	Pulling test: 17.64N force, Keep time 10s. Bending test: Deflection 2mm, Speed: 0.5mm/sec, Keep time: 601s.
Loading at High Temperature	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Temperature: 852 Time: 1000 hours Apply rated current. Measurement at 244 hours after test conclusion.