Lead free SMD power inductor microgate MPIE201610-1R0M-LF Ni-Zn Ferrite core for electronic circuits

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Product Description

Product Overview

The MPIE201610 series of SMD power inductors are designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. They are suitable for use in a wide range of operating temperatures and are compliant with lead-free standards.

Product Attributes

Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Origin: P.R.C.
Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
Color: Not specified
Certifications: Lead-free products

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max	DCR () Typ	Isat (A) Max	Isat (A) Typ	Irms (A) Max	Irms (A) Typ
MPIE201610-R24M-LF	0.2420%	0.032	0.025	4.50	4.85	3.70	4.30
MPIE201610-R33M-LF	0.3320%	0.026	0.022	3.20	3.50	4.50	5.00
MPIE201610-R47M-LF	0.4720%	0.042	0.035	2.55	3.60	2.80	3.00
MPIE201610-R68M-LF	0.6820%	0.058	0.048	2.50	3.00	2.60	3.00
MPIE201610-1R0M-LF	1.020%	0.070	0.060	1.85	2.20	2.50	2.60
MPIE201610-1R5M-LF	1.520%	0.120	0.100	1.50	1.70	1.70	2.00
MPIE201610-2R2M-LF	2.220%	0.150	0.125	1.30	1.60	1.50	1.60
MPIE201610-4R7M-LF	4.720%	0.350	0.265	1.00	1.10	1.00	1.10
MPIE201610-100M-LF	1020%	0.815	0.680	0.68	0.75	0.61	0.70
MPIE201610-150M-LF	1520%	1.440	1.200	0.40	0.50	0.40	0.45
MPIE201610-220M-LF	2220%	1.750	1.460	0.50	0.53	0.36	0.40

Item	Required Characteristics	Test Method/Condition
High temperature storage test	No case deformation or change in appearance. \| L\|/L10%	Temperature: 1252, Time: 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature storage test	No case deformation or change in appearance. \| L\|/L10%	Temperature: -402, Time: 1000 hours. Measurement at 244 hours after test conclusion.
Humidity test	No case deformation or change in appearance. \| L\|/L10%	Temperature: 25-85, Humidity: 85% RH, Time: 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock test	No case deformation or change in appearance. \| L\|/L10%	-40 for 30min. to 125 for 30min. as 1 cycle. Go through 1000 cycles.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux.
Heat endurance of reflow soldering	No case deformation or change in appearance. \| L\|/L10%	Refer to reflow curve, Go through 3 times. The peak temperature: 260+5/-0.
Vibration test	No case deformation or change in appearance. \| L\|/L10%	Apply frequency 10~55Hz. 1.5mm amplitude in each of 3 mutually perpendicular directions for 2 hours each (total 6 hours).
Drop test	No case deformation or change in appearance. \| L\|/L10%	Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test	Terminal should not pull off.	Apply 17.64N force for 10s after soldering on PCB.
Bending test	Terminal should not pull off.	Bend the testing PCB at middle point, the deflection shall be 2mm. Pressurizing Speed: 0.5mm/sec, Keep time: 60 1s.
Loading at High Temperature	No case deformation or change in appearance. \| L\|/L10%	Temperature: 852, Time: 1000 hours, Apply rated current. Measurement at 244 hours after test conclusion.