Power Inductor Microgate MPIM252010H1R0M-LF Series Engineered for Electronic Component Applications

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Product Description

SMD Power Inductor MPIM252010H Series

The MPIM252010H series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are built to meet stringent industry standards.

Product Attributes

Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Origin: P.R.C.
Certifications: ROHS COMPLIANT
Product Series: MPIM252010H

Technical Specifications

Microgate Part No.	Inductance L0 (uH)	DCR () Max.	Isat (A) Max.	Irms (A) Max.
MPIM252010HR22M-LF	0.2220%	0.015	6.50	5.00
MPIM252010HR33M-LF	0.3320%	0.024	5.70	4.20
MPIM252010HR47M-LF	0.4720%	0.032	5.00	3.60
MPIM252010HR68M-LF	0.6820%	0.048	4.10	3.00
MPIM252010H1R0M-LF	1.020%	0.054	3.80	2.70
MPIM252010H1R5M-LF	1.520%	0.082	3.00	2.10
MPIM252010H2R2M-LF	2.220%	0.115	2.40	1.70

Dimensions

Dimension	Value (mm)
A	2.500.20
B	2.000.20
C	1.00 Max.
D	0.600.20
f	1.20 Typ.
g	2.80 Typ.
h	2.00 Typ.

Reliability Testing Summary

Item	Requirements	Test Methods and Remarks	Reference Sample Size
Solderability	(1) No case deformation or change in appearance. (2) Terminal area must have 95% min. solder coverage.	Temperature:255 5, flux 5-10 s. Sample immersion tin furnace 5 0.5s. Immersed and in and out of speed: 25 6mm/s. AEC-Q200 (J-STD-002)	15
Resistance to Soldering Heat	(1) No case deformation or change in appearance. (2)L0/L010%	The peak temperature: 260+5/-0. Reflow:3times. Temperature curve is as below: AEC-Q200 (MIL-STD-20 2 Method 210)	30
High Temperature Storage	-	Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. AEC-Q200 (MIL-STD -202 Method 108)	77
Low Temperature Storage	-	Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion. JESD22-A119	77
Thermal shock	-	First -40 for 15 minutes, last 125 15minutes as 1 cycle. Go through 300 cycles. Max transfer time is 20 second. Measurement at 244 hours after test conclusion. MIL-STD -202 Method 107	30
Humidity Resistance	(1) No case deformation or change in appearance. (2)L0/L010%	1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion. AEC-Q200 (MIL-STD -202 Method 103)	77
Terminal Strength	-	The test samples shall be soldered to the board. 17.64N, 60s,X,Ydirect. AEC-Q200 (AEC-Q200-0 06)	30
Board Flex	-	Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. AEC-Q200 (AEC-Q200-0 05)	30
Drop	-	Height: 1 m, Free fall, 10times. Direction: 1 Angle, 1side, 2surface. JESD22-B111	30
Vibration	-	Frequency range : 10~2000Hz. Amplitude: 1.5mm or 20 G. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours(12 times) in X,Y,Z direction, 12 hours in total. AEC-Q200 (MIL-STD-20 2 Method 204)	30
Loading at High Temperature	(1) No case deformation or change in appearance. (2)L0/L010%	Temperature: 852. Time : 1000 hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion. AEC-Q200 (MIL-PRF-27)	77

Recommended Soldering Conditions

Reflow Soldering

Refer to J-STD-020D for reflow soldering curve.

Iron Soldering

Pre-heating: 150 (1 minute)
Tip temperature: 350 max
Soldering iron output: 30w max
End of soldering iron: 1mm max
Soldering time: 3 seconds max

Package Information

Packaging Quantities: 2000PCS/Reel.
Peeling Strength of Cover Tape: 0.10N to 1.0N (EIA-481-D standard)

Product Storage

Storage Period: Products inspected over 12 months ago should be re-examined. Solderability should be checked if this period is exceeded.
Storage Conditions: Temperature: -10 ~+ 35, Humidity: Less than 70% RH. Avoid rapid changes in temperature and humidity.
Environmental Considerations: Do not store in corrosive gases (sulfur, chlorine gas, acid) to prevent oxidation and poor solderability.
Handling: Store on palettes.