SMD power inductor microgate MPIA201610-R47M-LF mixed alloy core enameled copper wire winding epoxy resin magnetic glue
SMD Power Inductor MPIA201610 Series
The MPIA201610 series is a range of SMD power inductors designed for various electronic applications. These inductors are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. and are built with high-quality materials including mixed alloy for the core and enameled copper wire for the winding.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD., P.R.C.
- Material: Core: Mixed Alloy Material; Wire: Enameled Copper Wire; Terminal: Ag/Ni/Sn/Cu; Magnetic Glue: Epoxy resin and magnetic powder.
- Certifications: Lead-free products (LF designation)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | DCR () Typ | Isat (A) Max | Isat (A) Typ | Irms (A) Max | Irms (A) Typ |
| MPIA201610-R24M-LF | 0.2420% | 0.032 | 0.028 | 5.00 | 5.50 | 3.65 | 4.30 |
| MPIA201610-R33M-LF | 0.3320% | 0.032 | 0.028 | 4.00 | 4.60 | 4.00 | 4.80 |
| MPIA201610-R47M-LF | 0.4720% | 0.035 | 0.029 | 3.50 | 4.00 | 3.80 | 4.50 |
| MPIA201610-R68M-LF | 0.6820% | 0.057 | 0.048 | 3.00 | 3.40 | 2.60 | 3.00 |
| MPIA201610-1R0M-LF | 1.020% | 0.090 | 0.075 | 2.70 | 3.15 | 2.10 | 2.40 |
| MPIA201610-1R5M-LF | 1.520% | 0.130 | 0.110 | 2.00 | 2.20 | 1.70 | 2.00 |
| MPIA201610-2R2M-LF | 2.220% | 0.165 | 0.138 | 1.75 | 2.10 | 1.25 | 1.45 |
| MPIA201610-4R7M-LF | 4.720% | 0.430 | 0.375 | 1.00 | 1.30 | 0.90 | 1.00 |
Dimensions
| Dimensions in mm | A | B | C | D | E | f | h | g |
| 2.000.20 | 1.600.20 | 1.00Max. | 0.600.2 | 0.600.2 | 0.80 Typ. | 1.60 Typ. | 2.20 Typ. |
Operating Conditions
The part normal work is allowed ambient temperature: -40 ~ +125.
Testing Conditions
Unless otherwise specified, tests are conducted at ordinary temperature (5 to 35) and ordinary humidity (25 to 85% RH). In case of doubt, tests are performed at 202, 60 to 75% RH, and 86 to 106 kPa atmospheric pressure.
Reliability Testing
Various reliability tests are performed, including high temperature storage, low temperature storage, humidity test, thermal shock, solderability, heat endurance of reflow soldering, vibration, drop, terminal strength, and high temperature load. Specific conditions and acceptance criteria are defined for each test.
Soldering Conditions
The product can be used for flow and reflow soldering. Recommended flux is rosin-based, and solder is Sn. Specific temperature profiles and conditions for both flow and reflow soldering are provided to ensure product quality.
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