SMD power inductor Microgate MPIH252012-3R3M-LF with Ag Ni Sn Cu terminals and Ni-Zn ferrite core material
Product Overview
This specification applies to the MPIH252010 series of SMD power inductors. These inductors are designed for various electronic applications requiring reliable power handling and inductance characteristics.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
- Certifications: Lead-free products (LF designation).
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | Isat (A) Typ | Irms (A) Typ |
| MPIH252012-R24M-LF | 0.2420% | 0.026 | 5.80 | 4.00 |
| MPIH252012-R33M-LF | 0.3320% | 0.030 | 5.05 | 5.25 |
| MPIH252012-R47M-LF | 0.4720% | 0.032 | 4.50 | 3.75 |
| MPIH252012-R68M-LF | 0.6820% | 0.045 | 4.00 | 3.50 |
| MPIH252012-1R0M-LF | 1.020% | 0.056 | 3.00 | 3.50 |
| MPIH252012-1R5M-LF | 1.520% | 0.072 | 2.30 | 2.25 |
| MPIH252012-2R2M-LF | 2.220% | 0.100 | 1.90 | 2.20 |
| MPIH252012-3R3M-LF | 3.320% | 0.144 | 1.70 | 1.60 |
| MPIH252012-4R7M-LF | 4.720% | 0.216 | 1.40 | 1.35 |
| MPIH252012-6R8M-LF | 6.820% | 0.300 | 1.20 | 1.05 |
| MPIH252012-100M-LF | 1020% | 0.462 | 1.00 | 0.90 |
| MPIH252012-470M-LF | 4720% | 2.250 | 0.42 | 0.35 |
Dimensions
| Dimensions in mm | A | B | C | D | E | f | g | h |
| Value | 2.500.20 | 2.000.20 | 1.20Max. | 0.800.2 | 0.800.2 | 0.80 Typ. | 2.50 Typ. | 2.00 Typ. |
Operating Conditions
Product normal work ambient temperature: -40 ~ +125.
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering. Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%. Use Sn solder.
Flow Soldering Conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150 max. Cooling into solvent after soldering also should be in such a way that temperature difference is limited to 100 max.
Reflow Soldering Conditions
Profile Feature: Average Ramp-Up Rate (Ts max. to Tp): 3/second max. Preheat (Ts min. to Ts max.): 150 to 200, 60-180 seconds. Time maintained above Temperature (TL): 217, 60-150 seconds. Peak/Classification Temperature (Tp): 260, 3-4 seconds.
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