SMD power inductor Microgate MPIE201610-4R7M-LF series lead free product for electronic applications
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The MPIE201610 series of SMD power inductors are designed for various electronic applications. This specification outlines the product's identification, dimensions, materials, testing conditions, electrical characteristics, operating conditions, reliability, soldering requirements, packaging, and storage.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Origin: P.R.C.
- Product Type: SMD power inductor
- Series: MPIE201610 series
- Environmental Compliance: Lead free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | DCR () Typ | Isat (A) Max | Isat (A) Typ | Irms (A) Max | Irms (A) Typ |
| MPIE201610-R24M-LF | 0.2420% | 0.032 | 0.025 | 4.50 | 4.85 | 3.70 | 4.30 |
| MPIE201610-R33M-LF | 0.3320% | 0.026 | 0.022 | 3.20 | 3.50 | 4.50 | 5.00 |
| MPIE201610-R47M-LF | 0.4720% | 0.042 | 0.035 | 2.55 | 3.60 | 2.80 | 3.00 |
| MPIE201610-R68M-LF | 0.6820% | 0.058 | 0.048 | 2.50 | 3.00 | 2.60 | 3.00 |
| MPIE201610-1R0M-LF | 1.020% | 0.070 | 0.060 | 1.85 | 2.20 | 2.50 | 2.60 |
| MPIE201610-1R5M-LF | 1.520% | 0.120 | 0.100 | 1.50 | 1.70 | 1.70 | 2.00 |
| MPIE201610-2R2M-LF | 2.220% | 0.150 | 0.125 | 1.30 | 1.60 | 1.50 | 1.60 |
| MPIE201610-4R7M-LF | 4.720% | 0.350 | 0.265 | 1.00 | 1.10 | 1.00 | 1.10 |
| MPIE201610-100M-LF | 1020% | 0.815 | 0.680 | 0.68 | 0.75 | 0.61 | 0.70 |
| MPIE201610-150M-LF | 1520% | 1.440 | 1.200 | 0.40 | 0.50 | 0.40 | 0.45 |
| MPIE201610-220M-LF | 2220% | 1.750 | 1.460 | 0.50 | 0.53 | 0.36 | 0.40 |
| Item | Required Characteristics | Test Method/Condition |
| High temperature storage test | 1. No case deformation or change in appearance. 2. Inductance change 10% (|L|/L10%) | Temperature: 1252 Time: 1000 hours Measurement at 244 hours after test conclusion. |
| Low temperature storage test | - | Temperature: -402 Time: 1000 hours Measurement at 244 hours after test conclusion. |
| Humidity test | - | Temperature: 25-85, Humidity: 85% RH Time: 1000 hours Measurement at 244 hours after test conclusion. |
| Thermal shock test | - | -40 for 30min, then 125 for 30min, 1000 cycles. |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux. |
| Heat endurance of reflow soldering | 1. No case deformation or change in appearance. 2. Inductance change 10% (|L|/L10%) | Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. |
| Vibration test | - | 10~55Hz, 1.5mm amplitude in each of 3 mutually perpendicular directions for 2 hours each (total 6 hours). |
| Drop test | - | Drop 10 times on a concrete floor from a height of 1m. |
| Terminal strength push test | - | Apply 17.64N force for 10s after soldering on PCB. |
| Bending test | Terminal should not pull off. | Solder products on PCB, bend testing PCB at middle point (2mm deflection) at 0.5mm/sec speed, hold for 601s. |
| Loading at High Temperature | 1. No case deformation or change in appearance. 2. |L|/L10% | Temperature: 852 Time: 1000 hours Apply rated current. Measurement at 244 hours after test conclusion. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina