SMD power inductors microgate MPIT4030-1R5N-LF with lead free certification and magnetic powder epoxy resin
Price:
Negotiable
MOQ:
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Delivery Time:
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Product Description
Product Overview
The MPIT4030 series is a range of SMD power inductors designed for various electronic applications. These components offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
Product Attributes
- Brand: Microgate
- Origin: Shenzhen, P.R.C.
- Material: Ferrite Core (Ni-Zn Ferrite), Enameled Copper Wire, Ag/Ni/Sn/Cu Terminal Electrode, Epoxy resin and magnetic powder (Magnetic Glue)
- Certifications: Lead free product
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () | Isat 1 (A) | Irms 2 (A) | SRF (MHz) |
| MPIT4030-R91N-LF | 0.9130% | 0.022 | 7.00 | 3.15 | 100 |
| MPIT4030-1R2N-LF | 1.230% | 0.025 | 5.90 | 2.96 | 80 |
| MPIT4030-1R5N-LF | 1.530% | 0.030 | 5.40 | 2.92 | 62 |
| MPIT4030-1R8N-LF | 1.830% | 0.030 | 4.40 | 2.92 | 60 |
| MPIT4030-2R2N-LF | 2.230% | 0.035 | 4.30 | 2.57 | 52 |
| MPIT4030-3R3M-LF | 3.320% | 0.040 | 3.30 | 2.40 | 38 |
| MPIT4030-4R3M-LF | 4.320% | 0.051 | 2.95 | 2.13 | 37 |
| MPIT4030-4R7M-LF | 4.720% | 0.060 | 2.90 | 2.00 | 31 |
| MPIT4030-5R6M-LF | 5.620% | 0.065 | 2.60 | 1.95 | 30 |
| MPIT4030-6R2M-LF | 6.220% | 0.070 | 2.50 | 1.85 | 29 |
| MPIT4030-6R8M-LF | 6.820% | 0.084 | 2.60 | 1.65 | 24 |
| MPIT4030-7R5M-LF | 7.520% | 0.084 | 2.20 | 1.65 | 26 |
| MPIT4030-8R2M-LF | 8.220% | 0.090 | 2.10 | 1.60 | 26 |
| MPIT4030-9R1M-LF | 9.120% | 0.095 | 2.00 | 1.55 | 23 |
| MPIT4030-100M-LF | 1020% | 0.096 | 1.95 | 1.52 | 21 |
| MPIT4030-120M-LF | 1220% | 0.131 | 1.70 | 1.30 | 18 |
| MPIT4030-150M-LF | 1520% | 0.189 | 1.65 | 1.11 | 16 |
| MPIT4030-180M-LF | 1820% | 0.200 | 1.40 | 1.10 | 10 |
| MPIT4030-220M-LF | 2220% | 0.225 | 1.30 | 1.00 | 10 |
| MPIT4030-330M-LF | 3320% | 0.320 | 1.10 | 0.85 | 10 |
| MPIT4030-360M-LF | 3620% | 0.335 | 1.05 | 0.83 | 9.8 |
| MPIT4030-390M-LF | 3920% | 0.345 | 1.03 | 0.80 | 10 |
| MPIT4030-430M-LF | 4320% | 0.440 | 1.00 | 0.73 | 9.2 |
| MPIT4030-470M-LF | 4720% | 0.445 | 0.95 | 0.72 | 8.4 |
| MPIT4030-510M-LF | 5120% | 0.470 | 0.90 | 0.70 | 8.4 |
| MPIT4030-560M-LF | 5620% | 0.555 | 0.85 | 0.65 | 8.4 |
| MPIT4030-620M-LF | 6220% | 0.829 | 0.80 | 0.53 | 7.0 |
| MPIT4030-680M-LF | 6820% | 0.868 | 0.75 | 0.52 | 7.0 |
| MPIT4030-750M-LF | 7520% | 0.920 | 0.70 | 0.50 | 6.3 |
| MPIT4030-820M-LF | 8220% | 0.970 | 0.66 | 0.48 | 5.6 |
| MPIT4030-910M-LF | 9120% | 1.070 | 0.62 | 0.46 | 5.6 |
| MPIT4030-101M-LF | 10020% | 1.110 | 0.60 | 0.45 | 5.6 |
| MPIT4030-121M-LF | 12020% | 1.250 | 0.53 | 0.43 | 5.4 |
Dimensions
| Model | A (mm) | B (mm) | C (Max. mm) | D (mm) | E (mm) | f (Typ. mm) | g (Typ. mm) | h (Typ. mm) |
| MPIT4030 | 4.000.20 | 4.000.20 | 3.00 | 2.000.20 | 1.000.20 | 1.90 | 4.10 | 3.40 |
Testing Conditions
Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa.
Reference Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Work Conditions
Ambient Temperature: -25 to +85.
Allowed High Temperature: +125.
Temperature Dependent: 40.
Storage Temperature: -25 to +85.
Storage Life: Half a year.
Work Ambient Frequency: 0.1MHz to 1MHz.
Reliability and Test Conditions
| Item | Required Characteristics | Test Method/Condition |
| High temperature resistance | 1. No case deformation or change in appearance. 2. |L|/L10% | Temperature: 1252, Time: 1000 hours. Tested not less than 1 hour, nor more than 2 hours at room temperature. |
| Low temperature resistance | N/A | Temperature: -402, Time: 1000 hours. Tested not less than 1 hour, nor more than 2 hours at room temperature. |
| Humidity test | N/A | Exposure: Temperature: 602, Humidity: 933% RH, Time: 1000 hours. Tested while the specimens are still in the chamber. Tested not less than 1 hour, nor more than 2 hours at room temperature. |
| Thermal shock test | 1. No case deformation or change in appearance. 2. |L|/L10% | First -40 for T time, last 125 T time as 1 cycle. Go through 100 cycles. |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for <5 second. Solder: lead free, Flux: rosin flux. |
| Heat endurance of reflow soldering | 1. No case deformation or change in appearance. 2. |L|/L10% | Refer to reflow curve. Go through 3 times. Peak temperature: 260+5/-0. |
| Vibration test | N/A | Apply frequency 10~55Hz, 1.5mm amplitude in each of perpendicular direction for 2 hours in each 3 mutually perpendicular directions (total 6 hours). |
| Drop test | N/A | Packaged & drop down from 1m with 981m/s(100G) attitude in 1 angle 1 ridges & 2 surfaces orientations. |
| Terminal strength push test | N/A | Pulling test: Apply a force of 10N in the direction of the arrow for 5s. Bending test: Bend the testing PCB at middle point, deflection shall be 2mm. Pressurizing Speed: 0.5mm/sec, Keep time: 30 1s. |
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering. Use rosin-based flux and lead-free solder.
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