SMD power inductor microgate MPSM160808BE2R2M20-LF with 2.2 microhenry inductance and 20 volt rating

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The MPSM160808BE series of SMD power inductors are designed for various electronic applications. These inductors offer reliable performance and are compliant with ROHS+HS standards.

Product Attributes

Brand: MICROGATE
Manufacturing Name: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Origin: Shenzhen, China
Certifications: ROHS+HS COMPLIANT

Technical Specifications

Microgate Part No.	Inductance L0 (uH)	DCR (m) Max.	DCR (m) Typ.	Isat (A) Max.	Isat (A) Typ.	Irms (A) Max.	Irms (A) Typ.	Rated Voltage (V)	Operating Temperature Range ()
MPSM160808BE2R2M20-LF	2.220%	290	241	1.2	1.3	1.0	1.1	20	-55 ~ +125

Reliability Testing

Item	Requirements	Test Methods and Remarks	Reference	Sample Size
Solderability	Terminal area must have 95% min. solder coverage.	8hours steam age test. Temperature:245 5, flux 5-10 s. Sample immersion tin furnace 5 0.5s. Immersed and in and out of speed: 25 6mm/s.	AEC-Q200 (J-STD-002)	15
Resistance to Soldering Heat	(1) No physical damage. (2)L0/L010%	The peak temperature: 260+5/-0. Reflow:3times. Temperature curve is as below:	AEC-Q200 (MIL-STD-20 2 Method 210)	30
High Temperature Storage		Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.	AEC-Q200 (MIL-STD -202 Method 108)	77
Low Temperature Storage		Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion.	JESD22-A119	77
Thermal shock		First -40 for 15 minutes, last 125 15minutes as 1 cycle. Go through 300 cycles. Max transfer time is 20 second. Measurement at 244 hours after test conclusion.	MIL-STD -202 Method 107	30
Humidity Resistance	(1) No physical damage. (2)L0/L010%	1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion.	AEC-Q200 (MIL-STD -202 Method 103)	77
Terminal Strength	No physical damage.	The test samples shall be soldered to the board. 5.0N, 100.5s.	MIL-STD-202	30
Board Flex	(1) No physical damage. (2)L0/L010%	Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds.	AEC-Q200 (AEC-Q200-0 05)	30
Drop		Height: 1 m, Free fall, 10times. Direction: 1 Angle, 1side, 2surface.	JESD22-B111	30
Vibration		Frequency range : 10~2000Hz. Amplitude: 1.5mm, 5g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours(12 times) in X,Y,Z direction, 12 hours in total.	AEC-Q200 (MIL-STD-20 2 Method 204)	30
Loading at High Temperature	(1) No physical damage. (2)L0/L010%	Temperature: 852. Time : 1000 hours. Rated current. Measurement at 244 hours after test conclusion.	AEC-Q200 (MIL-PRF-27)	77

Recommended Soldering Conditions

Method	Conditions
Reflow soldering	Refer to J-STD-0020D curve.
Iron soldering	Pre-heating: 150 1 minute Tip temperature: 350 max Soldering iron output: 30w max End of soldering iron tip diameter: 1mm max Soldering time: 3 seconds max

Package Information

Item	Dimension (mm)	Details
Tape Dimension	W: 8.00.1, A0: 1.150.05, B0: 1.950.05, K0: 0.980.1, E: 0.980.1, F: 1.750.1, P: 3.50.1, P0: 4.00.1, D0: 4.00.1, T: 1.5+0.1/-0.0, 0.180.02
Reel Dimension	A: 1782, B: 582, C: 13.50.2, G: 9.00.5
Taping Figure	Drawing direction
Packaging Quantities	3000PCS/Reel
Peeling Strength of Cover Tape	0.10N to 1.0N	Standard: EIA-481-D

Products Storage

Condition	Details
Storage Period	Products inspected over 12 months ago should be examined and used. Solderability should be checked if this period is exceeded.
Storage Conditions	Temperature: -10 ~+ 35 Humidity: Less than 70% relative humidity No rapid change on temperature and humidity.
Prohibited Storage	Do not keep products in corrosive gases such as sulfur, chlorine gas or acid.
Placement	Store on a palette for prevention from humidity, dust, etc.
Environmental Factors	Avoid heat shock, vibration, direct sunlight.
Packaging	Store under airtight packaged condition.