SMD Power Inductor Microgate MPIT5040-470M-LF with Enameled Copper Wire and Lead Free Certification
Product Overview
The MPIT5040 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue
- Certifications: Lead-free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | Isat (A) Max. | Irms (A) Max. | SRF (MHz) |
| MPIT5040-1R0N-LF | 1.0 30% | 0.012 | 7.35 | 4.90 | 117 |
| MPIT5040-1R5N-LF | 1.530% | 0.015 | 6.30 | 4.30 | 86 |
| MPIT5040-2R2N-LF | 2.230% | 0.019 | 4.90 | 3.80 | 50 |
| MPIT5040-2R7N-LF | 2.730% | 0.022 | 4.30 | 3.60 | 37 |
| MPIT5040-3R3N-LF | 3.3 30% | 0.024 | 3.95 | 3.40 | 32 |
| MPIT5040-3R9N-LF | 3.9 30% | 0.027 | 3.55 | 3.20 | 29 |
| MPIT5040-4R7N-LF | 4.730% | 0.030 | 3.50 | 3.00 | 28 |
| MPIT5040-6R8M-LF | 6.820% | 0.043 | 2.90 | 2.50 | 21 |
| MPIT5040-100M-LF | 1020% | 0.064 | 2.35 | 2.10 | 18 |
| MPIT5040-150M-LF | 1520% | 0.086 | 2.00 | 2.00 | 13 |
| MPIT5040-220M-LF | 2220% | 0.129 | 1.60 | 1.50 | 11 |
| MPIT5040-330M-LF | 3320% | 0.188 | 1.30 | 1.20 | 9 |
| MPIT5040-470M-LF | 4720% | 0.272 | 1.10 | 1.00 | 7 |
| MPIT5040-680M-LF | 6820% | 0.400 | 0.90 | 0.80 | 6 |
| MPIT5040-101M-LF | 10020% | 0.560 | 0.75 | 0.70 | 5 |
Dimensions
Dimensions in mm: A: 5.00.2, B: 5.00.2, C: 4.1Max., D: 2.00.3, E: 1.50.3, F: 4.0Typ., G: 1.5 Typ., H: 3.6 Typ.
Operating Conditions
Operating temperature range: -40 to +125.
Recommended Soldering Conditions
Suitable for flow and reflow soldering. Use rosin-based flux and Sn solder. Refer to the document for specific pre-heating, peak temperature, and time parameters for both flow and reflow soldering processes.
Reliability Testing
The product undergoes various reliability tests including high temperature storage, low temperature storage, humidity test, thermal shock, solderability, heat endurance of reflow soldering, vibration, drop test, terminal strength, and high temperature load testing to ensure performance and durability.
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