Power Inductor SMD Type Microgate MPIH201610-4R7M-LF Suitable for Electronic Power Management Systems
Price:
Negotiable
MOQ:
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Delivery Time:
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Product Description
SMD Power Inductor - MPIH201610 Series
This specification applies to the MPIH201610 series of SMD power inductors. These components are designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Product Name: (SMD power inductor)
- Series: MPIH201610 series
- Origin: Shenzhen, P.R.C.
- Environmental Compliance: Lead free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR Max () | Isat Max (A) | Irms Max (A) |
| MPIH201610-R24M-LF | 0.2420% | 0.032 | 3.80 | 3.70 |
| MPIH201610-R33M-LF | 0.3320% | 0.041 | 3.50 | 3.50 |
| MPIH201610-R47M-LF | 0.4720% | 0.041 | 2.35 | 2.80 |
| MPIH201610-R68M-LF | 0.6820% | 0.060 | 2.20 | 2.60 |
| MPIH201610-1R0M-LF | 1.020% | 0.072 | 1.70 | 2.00 |
| MPIH201610-2R2M-LF | 2.220% | 0.215 | 1.10 | 1.25 |
| MPIH201610-3R3M-LF | 3.320% | 0.380 | 1.00 | 0.95 |
| MPIH201610-4R7M-LF | 4.720% | 0.420 | 0.90 | 0.90 |
| MPIH201610-6R8M-LF | 6.820% | 0.660 | 0.70 | 0.70 |
| MPIH201610-100M-LF | 1020% | 0.820 | 0.60 | 0.60 |
Dimensions and Material
| Item | Material | Dimensions (mm) |
| Core | Ni-Zn Ferrite | A: 2.000.20, B: 1.600.20, C: 1.00 Max. |
| Wire | Enameled Copper Wire | f: 0.80 Typ., g: 2.20 Typ. |
| Terminal | Ag/Ni/Sn/Cu | D: 0.600.2, E: 0.600.2, h: 1.60 Typ. |
| Magnetic Glue | Epoxy resin and magnetic powder |
Reliability and Test Conditions
Operating Temperature: -40 ~ +125
Testing Conditions: Unless otherwise specified, temperature: 5 to 35, humidity: 25 to 85% RH. In case of doubt, temperature: 202, humidity: 60 to 75% RH, atmospheric pressure: 86 to 106 kPa.
Reliability Tests:
- High temperature storage: 1252 for 1000 hours.
- Low temperature storage: -402 for 1000 hours.
- Humidity test: 25-85, 85% RH for 1000 hours.
- Thermal shock: 1000 cycles of -40 (30 min) to 125 (30 min).
- Solderability: 90% min. solder coverage on terminal area.
- Heat endurance of reflow soldering: 3 reflow cycles, peak temperature 260+5/-0.
- Vibration: 10~55Hz, 1.5mm amplitude, 2 hours per direction (3 directions total).
- Drop test: 1 meter onto concrete floor, 10 times.
- Terminal strength: 17.64N pull/push test, 10 seconds.
- Loading at High Temperature: 852 for 1000 hours with rated current.
Recommended Soldering Conditions
Suitable for flow and reflow soldering.
- Flux: Rosin-based flux.
- Solder: Sn solder.
- Flow soldering: Temperature difference between product surface and solder max 150 during preheating, max 100 during cooling.
- Reflow soldering: Peak temperature 260, 3-4 seconds. Average ramp-up rate max 3/second.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina