Lead free SMD power inductor microgate MPIT5040-2R2N-LF with ferrite core epoxy adhesive and performance

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Product Description

Product Overview

The MPIT series of SMD power inductors are designed for various electronic applications. These inductors are constructed with a ferrite core and enameled copper wire, offering reliable performance and durability. They are lead-free and suitable for both flow and reflow soldering processes.

Product Attributes

Brand: MICROGATE (implied from storage section)
Material: Ferrite Core, Enameled Copper Wire, Sn99.7-Cu0.3 Solder, Epoxy Adhesive
Certifications: Lead Free

Technical Specifications

Part No.	Inductance (uH)	DCR (m)max	Isat (A) max	Irms (A) max
MPIT5040-1R0N-LF	1.030%	13	7.35	4.9
MPIT5040-1R5N-LF	1.530%	15	6.30	4.2
MPIT5040-2R2N-LF	2.230%	19	4.90	3.7
MPIT5040-3R3N-LF	3.330%	24	3.95	3.4
MPIT5040-4R7M-LF	4.720%	30	3.50	3.0
MPIT5040-5R6M-LF	5.620%	33	3.2	2.5
MPIT5040-6R8M-LF	6.820%	49	3.0	2.3
MPIT5040-100M-LF	1020%	64	2.85	2.1
MPIT5040-150M-LF	1520%	86	2.5	2.0
MPIT5040-220M-LF	2220%	129	1.8	1.4
MPIT5040-330M-LF	3320%	188	1.5	1.2
MPIT5040-470M-LF	4720%	270	1.25	1.0
MPIT5040-680M-LF	6820%	400	0.96	0.77
MPIT5040-101M-LF	10020%	560	0.82	0.66
MPIT5040-221M-LF	22020%	1030	0.55	0.45

Item	Specifications	Test Method/Condition
Operating temperature range	25~ +85	Including temperature rise due to self-generated heat
Terminal strength-pull test	Terminal shall not be loosened or ruptured	A 5N. load shall be applied to both terminals in the axis direction for 60 sec.
Solderability test	The terminal shall be at least 90% covered with solder.	After fluxing, Inductor shall be dipped in a melted solder bath at 2305for 5 seconds.
Resistance to solvent test	There shall be no case deformation, change in appearance, obliteration of marking.	MIL-STD-105E
Vibration test (low frequency)	1. Inductors shall be no evidence of electrical and mechanical damage. 2. Inductance shall not change more than 5%. 3. Q shall not change more than 20%.	1. Amplitude: 1.5mm. 2. Frequency: 10~55~10Hz/min. 3. Direction: X.Y.Z. 4. Duration: 2 hrs/X.Y.Z.
Shock test	Inductors shall be dropped 10 times from a height of 1m onto 3cm wooden board.	N/A
Resistance to soldering heat	N/A	Temp: 2605, Time: 101sec
High temperature load life test	There shall be no evidence of Short or open circuiting.	1. Temp: 852. 2. Time: 100012 hours. 3. Load: allowed DC current.
Humidity load life	N/A	1. Temp: 402. 2. R.H: 90-95%. 3. Time: 100012 hours. 4. Load: allowed DC current.
Temperature characteristic	1. Inductors shall be no evidence of electrical and mechanical damage. 2. Inductance shall not change more than 5%. 3. Q shall not change more than 30%.	25~ +85
Humidity test	N/A	1. Temp: 402. 2. R.H: 90-95%. 3. Time: 962 hours.
Cold test	N/A	1. Temp: -402. 2. Time: 962 hours.
Thermal shock test	N/A	N/A
Dry heat test	N/A	1. Temp: 852. 2. Time: 962 hours.

Profile Feature	Lead-Free Assembly
Average Ramp-Up Rate (Ts max. to Tp)	3/second max.
Preheat Temperature Min (Ts min.)	150
Preheat Temperature Max (Ts max.)	200
Preheat Time (ts min to ts max.)	60-180 seconds
Time maintained above Temperature (TL)	217
Time maintained above Time (tL)	60-150 seconds
Peak/Classification Temperature (Tp)	260
Peak/Classification Time (Tp)	3-4 seconds
Time within 5 C of actual Peak Temperature (tp)	20-40 seconds
Ramp-Down Rate	6C/second max.
Time 25 C to Peak Temperature	8 minutes max.