SMD power inductor microgate MPIT4030-150M-LF with Ag Ni Sn Cu terminal and magnetic powder construction
Product Overview
This specification applies to the MPIT4030 series of SMD power inductors. These inductors are designed for various applications requiring reliable power handling and inductance characteristics.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Product Series: MPIT4030 series
- Product Type: SMD power inductor
- Origin: P.R.C.
- Material: Ni-Zn Ferrite (Core), Enameled Copper Wire (Wire), Ag/Ni/Sn/Cu (Terminal), Epoxy resin and magnetic powder (Magnetic Glue)
- Environmental Compliance: Lead free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
|---|---|---|---|---|---|---|---|
| MPIT4030-R91M-LF | 0.9120% | 0.017 | 0.013 | 7.00 | 8.00 | 4.15 | 4.70 |
| MPIT4030-1R0M-LF | 1.020% | 0.018 | 0.014 | 6.50 | 7.20 | 4.15 | 4.70 |
| MPIT4030-1R2M-LF | 1.220% | 0.020 | 0.015 | 6.00 | 6.80 | 3.82 | 4.20 |
| MPIT4030-1R5M-LF | 1.520% | 0.026 | 0.020 | 5.50 | 6.50 | 3.34 | 3.60 |
| MPIT4030-1R8M-LF | 1.820% | 0.033 | 0.025 | 5.50 | 5.80 | 3.20 | 3.30 |
| MPIT4030-2R2M-LF | 2.220% | 0.039 | 0.030 | 5.00 | 5.40 | 2.95 | 3.20 |
| MPIT4030-3R3M-LF | 3.320% | 0.052 | 0.040 | 3.60 | 4.20 | 2.40 | 2.65 |
| MPIT4030-3R9M-LF | 3.920% | 0.072 | 0.057 | 3.30 | 3.80 | 2.10 | 2.30 |
| MPIT4030-4R7M-LF | 4.720% | 0.078 | 0.060 | 2.70 | 3.20 | 2.00 | 2.20 |
| MPIT4030-5R6M-LF | 5.620% | 0.085 | 0.065 | 2.70 | 2.90 | 1.95 | 2.10 |
| MPIT4030-6R8M-LF | 6.820% | 0.109 | 0.084 | 2.30 | 2.80 | 1.65 | 1.80 |
| MPIT4030-8R2M-LF | 8.220% | 0.109 | 0.084 | 2.10 | 2.35 | 1.65 | 1.80 |
| MPIT4030-100M-LF | 1020% | 0.125 | 0.096 | 1.80 | 2.20 | 1.52 | 1.65 |
| MPIT4030-120M-LF | 1220% | 0.170 | 0.131 | 1.65 | 2.10 | 1.30 | 1.45 |
| MPIT4030-150M-LF | 1520% | 0.245 | 0.189 | 1.60 | 1.90 | 1.11 | 1.20 |
| MPIT4030-220M-LF | 2220% | 0.295 | 0.225 | 1.10 | 1.50 | 1.00 | 1.10 |
| MPIT4030-330M-LF | 3320% | 0.415 | 0.320 | 1.00 | 1.30 | 0.85 | 0.95 |
| MPIT4030-390M-LF | 3920% | 0.450 | 0.345 | 1.03 | 1.10 | 0.80 | 0.90 |
| MPIT4030-470M-LF | 4720% | 0.580 | 0.445 | 0.75 | 1.05 | 0.72 | 0.80 |
| MPIT4030-560M-LF | 5620% | 0.720 | 0.555 | 0.85 | 0.95 | 0.65 | 0.70 |
| MPIT4030-620M-LF | 6220% | 1.080 | 0.829 | 0.80 | 0.85 | 0.53 | 0.60 |
| MPIT4030-680M-LF | 6820% | 1.130 | 0.868 | 0.70 | 0.85 | 0.52 | 0.55 |
| MPIT4030-101M-LF | 10020% | 1.450 | 1.110 | 0.60 | 0.75 | 0.45 | 0.50 |
| MPIT4030-121M-LF | 12020% | 1.630 | 1.250 | 0.53 | 0.60 | 0.43 | 0.47 |
| MPIT4030-151M-LF | 15020% | 1.720 | 1.440 | 0.50 | 0.60 | 0.42 | 0.46 |
| MPIT4030-181M-LF | 18020% | 1.836 | 1.530 | 0.48 | 0.55 | 0.40 | 0.44 |
| MPIT4030-331M-LF | 33020% | 4.080 | 3.400 | 0.30 | 0.38 | 0.27 | 0.30 |
Testing Conditions
Unless otherwise specified: Temperature: 5 to 35, Humidity: 25 to 85% RH. In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Test Instruments and Remarks
- L & DCR: CHROMA 3302 meter.
- IDC: CHROMA 3302 and 1320 meter.
- L test condition: 100KHz/1V.
- Isat: Based on inductance change (|LI-L|/L30%).
- Irms: Based on temperature rise (T:40 TYP).
Operating Conditions
Ambient temperature: -40 to +125.
Reliability and Test Conditions
High temperature storage test: 1252 for 1000 hours. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Low temperature storage test: -402 for 1000 hours. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Humidity test: 25-85, 85% RH for 1000 hours. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Thermal shock test: 1000 cycles of -40 (30 min) to 125 (30 min).
Solderability test: Terminal area must have 90% min. solder coverage. Dip pads in flux then dip in solder pot at 2455 for 50.1 second.
Heat endurance of reflow soldering: Refer to reflow curve. Peak temperature: 260+5/-0. Requirements: No case deformation, |L|/L10%.
Vibration test: 10~55Hz, 1.5mm amplitude for 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Drop test: Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test: Apply 17.64N force for 10s.
Terminal strength bending test: Apply pressure at the middle point of the PCB, 2mm deflection at 0.5mm/sec speed, hold for 601s.
Loading at High Temperature: Temperature: 852, Time: 1000 hours, Apply rated current. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Recommended Soldering Conditions
Flux: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value). Use Sn solder.
Flow soldering conditions: Temperature difference between solder and product surface should not exceed 150 during pre-heating and 100 during cooling. Refer to standard soldering profile.
Reflow soldering conditions: Refer to reflow curve. Peak temperature: 260+5/-0.
Packaging
Not specified in the provided text.
Visual Inspection Standard of Product
Not specified in the provided text.
Storage
Not specified in the provided text.
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