Electronic SMD power inductors microgate MPIT3010-220M-LF with AgNiSnCu terminals and epoxy resin
Product Overview
The MPIT3010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD. They are suitable for use in a wide operating temperature range and are designed for compatibility with standard soldering processes.
Product Attributes
- Brand: MICROGATE
- Origin: P.R.C. (Shenzhen)
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
- Environmental Compliance: Lead-free products (LF).
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR Max. () | Isat Max. (A) | Irms (A) |
| MPIT3010-R56M-LF | 0.5620% | 0.048 | 2.50 | 2.00 |
| MPIT3010-R68M-LF | 0.6820% | 0.048 | 2.30 | 2.00 |
| MPIT3010-1R0M-LF | 1.020% | 0.066 | 1.95 | 1.75 |
| MPIT3010-1R5M-LF | 1.520% | 0.078 | 1.50 | 1.55 |
| MPIT3010-2R2M-LF | 2.220% | 0.096 | 1.20 | 1.40 |
| MPIT3010-3R3M-LF | 3.320% | 0.145 | 1.10 | 1.15 |
| MPIT3010-4R7M-LF | 4.720% | 0.222 | 0.95 | 0.95 |
| MPIT3010-6R8M-LF | 6.820% | 0.330 | 0.75 | 0.65 |
| MPIT3010-8R2M-LF | 8.220% | 0.348 | 0.70 | 0.70 |
| MPIT3010-100M-LF | 1020% | 0.480 | 0.65 | 0.65 |
| MPIT3010-150M-LF | 1520% | 0.624 | 0.50 | 0.50 |
| MPIT3010-220M-LF | 2220% | 1.000 | 0.40 | 0.40 |
| MPIT3010-330M-LF | 3320% | 1.200 | 0.30 | 0.30 |
Dimensions
| Dimensions in mm | A | B | C | D | E | f | g | h |
| Value | 3.00.20 | 3.00.20 | 1.00Max. | 1.500.2 | 0.750.2 | 1.50 Typ. | 3.10 Typ. | 2.70 Typ. |
Testing Conditions
Unless otherwise specified: Temperature: 5 to 35, Humidity: 25 to 85% RH. In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Electrical Characteristics Test Instruments
Inductance and DCR: CHROMA 3302 meter. Current: CHROMA 3302 and 1320 meter. L test condition: 100KHz/1V. Isat: Based on inductance change (|LI-L|/L30%). Irms: Based on temperature rise (T:40 TYP).
Operating Conditions
Normal work ambient temperature: -40 ~ +125.
Reliability and Test Conditions
High temperature storage test: 1252 for 1000 hours. No case deformation or appearance change. Inductance change 10%. Measurement after 244 hours at room temperature.
Low temperature storage test: -402 for 1000 hours. Measurement after 244 hours at room temperature.
Humidity test: 25-85, 85% RH for 1000 hours. Measurement after 244 hours at room temperature.
Thermal shock test: 1000 cycles of -40 for 30 min. followed by 125 for 30 min.
Solderability test: Terminal area must have 90% min. solder coverage. Dip pads in flux then dip in solder pot at 2455 for 50.1 second.
Heat endurance of reflow soldering: Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. No case deformation or appearance change. Inductance change 10%.
Vibration test: 10~55Hz, 1.5mm amplitude, 2 hours per direction, total 6 hours.
Drop test: Drop 10 times from 1m height onto a concrete floor.
Terminal strength push test: 17.64N force applied for 10s.
Bending test: PCB bend deflection of 2mm at 0.5mm/sec, maintained for 601s.
Loading at High Temperature: 852 for 1000 hours with rated current. No case deformation or appearance change. Inductance change 10%. Measurement after 244 hours at room temperature.
Recommended Soldering Conditions
Flux: Rosin-based flux. Do not use highly acidic flux with halide content exceeding 0.2wt%. Solder: Use Sn solder.
Flow soldering conditions: Temperature difference between product surface and solder max 150 during pre-heating. Temperature difference between product surface and solvent max 100 during cooling. Standard soldering profile applies.
Reflow soldering conditions: Preheat: 150, 1 minute max. Peak temperature: 350, 3 seconds max. Reflow curve profile: Average Ramp-Up Rate max 3/second. Preheat (Ts min 150, Ts max 200, time 60-180 seconds). Time maintained above 217 (TL) for 60-150 seconds. Peak Temperature (Tp) 260 for 3-4 seconds. Time within 5 C of actual Peak Temperature (Tp) 20-40 seconds. Ramp-Down Rate max 6C/second.
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