Surface mount device power inductor microgate MAPM0630F-R22M-LF with alloy core and copper terminals
SMD Power Inductor MAPM0630F Series
The MAPM0630F series is a range of Surface Mount Device (SMD) power inductors designed for various electronic applications. These inductors are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD., P.R.C.
- Material: Alloy Material Core, Enameled Copper Wire, Tin Covered Copper Terminal
- Certifications: ROHS COMPLIANT
Technical Specifications
| Microgate Part No. | Inductance L0 (uH) | DCR (m) Max | DCR (m) typ. | Isat (A) Typ. | Irms (A) Typ. |
| MAPM0630F-R15M-LF | 0.1520% | 2.7 | 2.3 | 40 | 23 |
| MAPM0630F-R22M-LF | 0.2220% | 3.5 | 3.0 | 32 | 20 |
| MAPM0630F-R33M-LF | 0.3320% | 4.0 | 3.5 | 28 | 19 |
| MAPM0630F-R47M-LF | 0.4720% | 4.5 | 3.2 | 25 | 18 |
| MAPM0630F-R56M-LF | 0.5620% | 5.5 | 4.7 | 24 | 16 |
| MAPM0630F-R68M-LF | 0.6820% | 5.8 | 5.5 | 23 | 15 |
| MAPM0630F-R82M-LF | 0.8220% | 8.0 | 6.5 | 20 | 13 |
| MAPM0630F-1R0M-LF | 1.020% | 9.0 | 7.5 | 16 | 11 |
| MAPM0630F-1R5M-LF | 1.520% | 16 | 13.8 | 14 | 9.0 |
| MAPM0630F-1R8M-LF | 1.820% | 16 | 14 | 13 | 9.0 |
| MAPM0630F-2R2M-LF | 2.220% | 20 | 15 | 12 | 8.0 |
| MAPM0630F-3R3M-LF | 3.320% | 30 | 28 | 10 | 6.0 |
| MAPM0630F-4R7M-LF | 4.720% | 40 | 38 | 9.0 | 5.5 |
| MAPM0630F-5R6M-LF | 5.620% | 54 | 50 | 7.0 | 5.0 |
| MAPM0630F-6R8M-LF | 6.820% | 60 | 51 | 6.0 | 4.5 |
| MAPM0630F-8R2M-LF | 8.220% | 80 | 75 | 5.7 | 4.0 |
| MAPM0630F-100M-LF | 1020% | 95 | 78 | 5.5 | 3.5 |
| MAPM0630F-150M-LF | 1520% | 140 | 130 | 3.5 | 2.8 |
| MAPM0630F-220M-LF | 2220% | 167 | 150 | 3.0 | 2.5 |
Dimensions
Dimensions in mm
| A | B | C | D | E | |
| Dimensions | 7.8Max. | 7.0Max. | 3.0 Max. | 1.50.5 | 3.00.3 |
Dimensions in mm
| A | B | C | |
| Recommend Land Pattern | 3.5 | 3.7 | 8.4 |
Testing Conditions
Unless otherwise specified, the standard conditions for measurement/test are: Ambient Temperature: 5 to 35, Relative Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa. If any doubt on the results, measurements/tests should be made within the following limits: Ambient Temperature: 251, Relative Humidity: 60 to 70% RH, Atmospheric Pressure: 86 to 106 kPa.
Reliability
Operating temperature: -55 to +125. The part temperature (ambient + temp rise) should not exceed 125 under worse case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Recommended Soldering Conditions
Reflow soldering conditions: Above reflow soldering curve is from J-STD-020D.
Iron soldering: Pre-heating 150 1 minute, Tip temperature 350 max, Soldering iron output 30w max, End of soldering iron 1mm max, Soldering time 3 seconds max.
Packaging
Packaging quantities: 1000PCS/Reel.
Peeling strength of cover tape: The peel force of top cover tape shall be between 0.1N to 1.3 N.
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