SMD power inductors microgate MPIT8040-100M-LF with enameled copper wire and lead free certification

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Product Description

Product Overview

The MPIT8040 series SMD power inductors are designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. in China.

Product Attributes

Brand: MICROGATE
Origin: Shenzhen, P.R.C.
Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
Certifications: Lead-free products (LF designation).

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max.	Isat (A) Max.	Irms (A) Max.	SRF (MHz) Typ.
MPIT8040-R47N-LF	0.4730%	0.007	0.005	16.5	110
MPIT8040-R68N-LF	0.6830%	0.007	0.005	15.5	104
MPIT8040-R82M-LF	0.8220%	0.008	0.006	15.2	95
MPIT8040-R90M-LF	0.9020%	0.008	0.006	11.0	92
MPIT8040-1R0M-LF	1.020%	0.008	0.006	12.0	90
MPIT8040-1R4M-LF	1.420%	0.009	0.007	9.00	68
MPIT8040-1R5M-LF	1.520%	0.010	0.008	10.0	67
MPIT8040-1R8M-LF	1.820%	0.012	0.009	9.50	48
MPIT8040-2R0M-LF	2.020%	0.012	0.009	9.25	42
MPIT8040-2R2M-LF	2.220%	0.016	0.012	8.30	41
MPIT8040-3R0M-LF	3.020%	0.018	0.014	7.10	30
MPIT8040-3R3M-LF	3.320%	0.020	0.015	7.52	28
MPIT8040-3R6M-LF	3.620%	0.020	0.015	7.52	30
MPIT8040-3R9M-LF	3.920%	0.022	0.017	6.30	26
MPIT8040-4R7M-LF	4.720%	0.023	0.018	6.00	23
MPIT8040-5R1M-LF	5.120%	0.025	0.019	6.00	23
MPIT8040-5R6M-LF	5.620%	0.027	0.021	6.00	24
MPIT8040-6R2M-LF	6.220%	0.027	0.021	5.10	20
MPIT8040-6R8M-LF	6.820%	0.031	0.024	4.95	20
MPIT8040-8R2M-LF	8.220%	0.034	0.026	4.30	17
MPIT8040-100M-LF	1020%	0.038	0.029	4.30	15
MPIT8040-120M-LF	1220%	0.053	0.041	3.55	12
MPIT8040-150M-LF	1520%	0.061	0.047	3.25	12
MPIT8040-180M-LF	1820%	0.068	0.052	3.10	11
MPIT8040-220M-LF	2220%	0.086	0.066	2.80	9.5
MPIT8040-270M-LF	2720%	0.101	0.078	2.60	9.0
MPIT8040-330M-LF	3320%	0.125	0.096	2.20	8.0
MPIT8040-360M-LF	3620%	0.133	0.102	2.10	7.8
MPIT8040-390M-LF	3920%	0.133	0.102	2.10	7.8
MPIT8040-430M-LF	4320%	0.147	0.113	1.90	7.5
MPIT8040-470M-LF	4720%	0.177	0.136	1.80	6.5
MPIT8040-510M-LF	5120%	0.185	0.142	1.70	6.4
MPIT8040-560M-LF	5620%	0.192	0.148	1.65	6.4
MPIT8040-620M-LF	6220%	0.237	0.182	1.55	6.3
MPIT8040-680M-LF	6820%	0.252	0.194	1.50	5.0
MPIT8040-750M-LF	7520%	0.274	0.211	1.40	4.9
MPIT8040-820M-LF	8220%	0.293	0.225	1.30	5.7
MPIT8040-910M-LF	9120%	0.354	0.272	1.20	5.0
MPIT8040-101M-LF	10020%	0.377	0.29	1.20	4.2
MPIT8040-121M-LF	12020%	0.428	0.329	1.15	3.5
MPIT8040-151M-LF	15020%	0.533	0.410	1.10	3.5
MPIT8040-221M-LF	22020%	0.702	0.540	0.85	3.5
MPIT8040-331M-LF	33020%	1.066	0.820	0.70	2.8

Item	Required Characteristics	Test Method/Condition
High temperature storage test	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Temperature: 1252 Time: 1000 hours Measurement at 244 hours after test conclusion.
Low temperature storage test	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Temperature: -402 Time: 1000 hours Measurement at 244 hours after test conclusion.
Humidity test	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Temperature: 25-85, Humidity: 85% RH Time: 1000 hours Measurement at 244 hours after test conclusion.
Thermal shock test	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	-40 for 30min. then 125 for 30min. as 1 cycle. Total 1000 cycles.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%
Heat endurance of reflow soldering	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Refer to reflow curve, 3 times. Peak temperature: 260+5/-0.
Vibration test	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Frequency 10~55Hz, 1.5mm amplitude in each of 3 perpendicular directions for 2 hours each (total 6 hours).
Drop test	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test	Terminal should not pull off.	Pulling test: Apply 17.64N force for 10s. Bending test: Apply pressure to bend PCB 2mm at 0.5mm/sec speed, hold for 601s.
Loading at High Temperature	1. No case deformation or change in appearance. 2. Inductance change 10% (\|L\|/L10%)	Temperature: 852 Time: 1000 hours Apply rated current. Measurement at 244 hours after test conclusion.