SMD power inductor microgate MPIT3010-8R2M-LF featuring Ni-Zn ferrite core and surface mount package
MPIT3010 Series SMD Power Inductor
The MPIT3010 series is a range of SMD power inductors designed for various electronic applications. These inductors are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. and offer reliable performance in a compact surface-mount package.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Product Name: SMD power inductor
- Series: MPIT3010 series
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
- Environmental Compliance: Lead-free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
| MPIT3010-R56M-LF | 0.5620% | 0.048 | 0.040 | 2.50 | 2.80 | 2.00 | 2.15 |
| MPIT3010-R68M-LF | 0.6820% | 0.048 | 0.040 | 2.30 | 2.50 | 2.00 | 2.15 |
| MPIT3010-1R0M-LF | 1.020% | 0.066 | 0.055 | 1.95 | 2.15 | 1.75 | 2.00 |
| MPIT3010-1R5M-LF | 1.520% | 0.078 | 0.065 | 1.50 | 1.65 | 1.55 | 1.70 |
| MPIT3010-2R2M-LF | 2.220% | 0.096 | 0.080 | 1.20 | 1.35 | 1.40 | 1.55 |
| MPIT3010-3R3M-LF | 3.320% | 0.145 | 0.120 | 1.10 | 1.20 | 1.15 | 1.25 |
| MPIT3010-4R7M-LF | 4.720% | 0.222 | 0.185 | 0.95 | 1.10 | 0.95 | 1.05 |
| MPIT3010-6R8M-LF | 6.820% | 0.330 | 0.275 | 0.75 | 0.85 | 0.65 | 0.70 |
| MPIT3010-8R2M-LF | 8.220% | 0.348 | 0.290 | 0.70 | 0.80 | 0.70 | 0.80 |
| MPIT3010-100M-LF | 1020% | 0.480 | 0.380 | 0.65 | 0.70 | 0.65 | 0.70 |
| MPIT3010-150M-LF | 1520% | 0.624 | 0.520 | 0.50 | 0.60 | 0.50 | 0.60 |
| MPIT3010-220M-LF | 2220% | 1.000 | 0.800 | 0.40 | 0.50 | 0.40 | 0.50 |
| MPIT3010-330M-LF | 3320% | 1.200 | 1.000 | 0.30 | 0.40 | 0.30 | 0.40 |
Dimensions
| Dimensions in mm | A | B | C | D | E | f | g | h |
| Size | 3.00.20 | 3.00.20 | 1.00Max. | 1.500.2 | 0.750.2 | 1.50 Typ. | 3.10 Typ. | 2.70 Typ. |
Testing Conditions
Unless otherwise specified, tests are conducted at ordinary temperature (5 to 35) and ordinary humidity (25 to 85% RH). In case of doubt, tests are performed at 202, 60 to 75% RH, and 86 to 106 kPa atmospheric pressure.
Operating Conditions
The part normal work is allowed in an ambient temperature range of -40 to +125.
Reliability and Test Conditions
Various reliability tests are performed including High temperature storage, Low temperature storage, Humidity test, Thermal shock, Solderability, Heat endurance of reflow soldering, Vibration, Drop, Terminal strength (push and bending), and Loading at High Temperature. Detailed conditions and required characteristics are outlined in the original specification.
Recommended Soldering Conditions
The product can be used for flow and reflow soldering. It is recommended to use rosin-based flux and Sn solder. Specific temperature profiles and conditions for both flow and reflow soldering are provided in the original specification.
Packaging
Packaging details are available in section 9 of the original specification.
Visual Inspection Standard
Visual inspection standards for the product are detailed in section 10 of the original specification.
Storage
Storage recommendations are provided in section 11 of the original specification.
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