Electronic Component Microgate MAPM0420F-100M-LF SMD Power Inductor Suitable for Various Circuits
Product Overview
The MAPM series of SMD Power Inductors are designed for various electronic applications. These inductors offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Material: Core: Carbonyl Iron Powder, Wire: Polyester-Imide, Terminal: Tin Covered Copper
- Certifications: Lead-Free (indicated by -LF suffix)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR (m) Typ. | Max Irms (A) | Isat (A) Typ. | Operating Temperature |
| MAPM0420F-R22M-LF | 0.2220% | 8 | 9.0 | 12.0 | -55 to +125 |
| MAPM0420F-R36M-LF | 0.3620% | 15 | 7.0 | 10.0 | -55 to +125 |
| MAPM0420F-R47M-LF | 0.4720% | 14 | 6.0 | 9.0 | -55 to +125 |
| MAPM0420F-R56M-LF | 0.5620% | 18 | 5.0 | 8.0 | -55 to +125 |
| MAPM0420F-1R0M-LF | 1.020% | 27 | 4.5 | 7.0 | -55 to +125 |
| MAPM0420F-1R5M-LF | 1.520% | 45 | 4.0 | 6.0 | -55 to +125 |
| MAPM0420F-2R2M-LF | 2.220% | 58 | 3.0 | 4.0 | -55 to +125 |
| MAPM0420F-3R3M-LF | 3.320% | 87 | 2.0 | 3.0 | -55 to +125 |
| MAPM0420F-4R7M-LF | 4.720% | 150 | 2.0 | 3.0 | -55 to +125 |
| MAPM0420F-100M-LF | 1020% | 200 | 1.5 | 1.8 | -55 to +125 |
Dimensions
| Model | A (Max.) | B (Max.) | C (Max.) | D (0.3) | E (0.5) | F (Typ.) | G (Typ.) | H (Typ.) |
| MAPM0420F | 4.9 | 4.4 | 2.0 | 1.0 | 1.5 | 2.30 | 4.95 | 2.16 |
Recommended Soldering Conditions
Flow Soldering: Pre-heating temperature difference between solder and product surface 150. Cooling into solvent 100.
Reflow Soldering Profile:
| Profile Feature | Lead-Free Assembly |
| Average Ramp-Up Rate (Ts max. to Tp) | 3/second max. |
| Preheat Temperature Min (Ts min.) | 150 |
| Preheat Temperature Max (Ts max.) | 200 |
| Preheat Time (ts min to ts max.) | 60-180 seconds |
| Time maintained above Temperature (TL) | 217 |
| Time maintained above Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Rework with Iron: Tip temperature 280 max, Soldering iron output 20w max, Tip 1mm max, Soldering time 3 seconds max.
Packaging
Packaging Quantities: 3000 PCS/Reel.
Peeling strength of cover tape: 0.1N to 1.3 N.
Storage Conditions
Temperature: -10 ~+ 40
Humidity: Less than 80% relative humidity
Other: No rapid change in temperature and humidity. Avoid corrosive gases, heat shock, vibration, and direct sunlight. Store in airtight packaged condition.
Get in Touch
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