SMD power inductor microgate MPIE252010-100M-LF ideal for electronic circuits requiring inductance

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Product Description

SMD Power Inductor MPIE252010 Series

This specification applies to the MPIE252010 series of SMD power inductors. These components are designed for various electronic applications requiring reliable power inductance.

Product Attributes

Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Series: MPIE252010 series
Product Type: SMD power inductor
Origin: Shenzhen, P.R.C.
Environmental Compliance: Lead-free products

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Max	DCR () Typ	Isat (A) Max	Isat (A) Typ	Irms (A) Max	Irms (A) Typ
MPIE252010-R24M-LF	0.2420%	0.030	0.022	4.00	5.50	3.90	4.30
MPIE252010-R33M-LF	0.3320%	0.038	0.030	3.80	4.05	3.30	3.90
MPIE252010-R47M-LF	0.4720%	0.038	0.030	3.70	3.90	3.30	3.90
MPIE252010-R68M-LF	0.6820%	0.053	0.040	3.00	3.50	3.00	3.20
MPIE252010-1R0M-LF	1.020%	0.072	0.060	2.30	2.60	2.30	2.60
MPIE252010-1R5M-LF	1.520%	0.103	0.085	2.00	2.20	1.90	2.10
MPIE252010-2R2M-LF	2.220%	0.130	0.108	1.50	1.70	1.80	2.00
MPIE252010-3R3M-LF	3.320%	0.210	0.190	1.45	1.60	1.25	1.50
MPIE252010-4R7M-LF	4.720%	0.318	0.265	1.20	1.30	1.10	1.20
MPIE252010-6R8M-LF	6.820%	0.470	0.425	1.00	1.10	0.90	1.10
MPIE252010-100M-LF	1020%	0.600	0.530	0.75	0.80	0.70	0.80
MPIE252010-150M-LF	1520%	0.990	0.825	0.50	0.60	0.45	0.50

Item	Required Characteristics	Test Method/Condition
High temperature storage test	No case deformation or change in appearance. \|L\|/L10%	Temperature: 1252, Time: 1000 hours. Measurement after 244 hours at room temperature.
Low temperature storage test	No case deformation or change in appearance. \|L\|/L10%	Temperature: -402, Time: 1000 hours. Measurement after 244 hours at room temperature.
Humidity test	No case deformation or change in appearance. \|L\|/L10%	Temperature: 25-85, Humidity: 85% RH, Time: 1000 hours. Measurement after 244 hours at room temperature.
Thermal shock test	No case deformation or change in appearance. \|L\|/L10%	-40 for 30 min. to 125 for 30 min. per cycle, 1000 cycles.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for 50.1 seconds. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux.
Heat endurance of reflow soldering	No case deformation or change in appearance. \|L\|/L10%	Refer to reflow curve, 3 times. Peak temperature: 260+5/-0.
Vibration test	No case deformation or change in appearance. \|L\|/L10%	10~55Hz, 1.5mm amplitude, 2 hours per direction, 3 directions (total 6 hours).
Drop test	No case deformation or change in appearance. \|L\|/L10%	Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test	Terminal should not pull off.	Apply 17.64N force for 10s after soldering on PCB.
Bending test	Terminal should not pull off.	Bend PCB at middle point by 2mm with 0.5mm/sec speed, hold for 601s.
Loading at High Temperature	No case deformation or change in appearance. \|L\|/L10%	Temperature: 852, Time: 1000 hours, Apply rated current. Measurement after 244 hours at room temperature.

Profile Feature	Specification
Average Ramp-Up Rate (Ts max. to Tp)	3/second max.
Preheat (Ts min.)	150
Preheat (Ts max.)	200
Preheat Time (ts min to ts max.)	60-180 seconds
Temperature (TL)	217
Time (tL)	60-150 seconds
Peak/Classification Temperature (Tp)	260
Peak/Classification Time (Tp)	3-4 seconds