Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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SMD power inductor microgate MPIA252010-3R3M-LF performance mixed alloy core epoxy resin magnetic glue

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The MPIA252010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are suitable for use in a wide operating temperature range.

Product Attributes

  • Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
  • Product Name: (SMD power inductor)
  • Series: MPIA252010 series
  • Origin: P.R.C
  • Material: Core: Mixed Alloy Material, Wire: Enameled Copper Wire, Terminal: Ag/Ni/Sn/Cu, Magnetic Glue: Epoxy resin and magnetic powder
  • Environmental Compliance: Lead free products (LF)

Technical Specifications

Microgate Part No.Inductance (uH)DCR Max ()Isat Max (A)Irms (A)
MPIA252010-R24M-LF0.2420%0.0305.703.85
MPIA252010-R33M-LF0.3320%0.0266.004.50
MPIA252010-R47M-LF0.4720%0.0385.503.60
MPIA252010-R68M-LF0.6820%0.0503.603.20
MPIA252010-1R0M-LF1.020%0.0653.202.80
MPIA252010-1R5M-LF1.520%0.1002.702.00
MPIA252010-2R2M-LF2.220%0.1301.901.80
MPIA252010-3R3M-LF3.320%0.2251.801.40
MPIA252010-4R7M-LF4.720%0.3101.501.15
MPIA252010-100M-LF1020%0.6000.950.90
ItemRequired CharacteristicsTest Method/Condition
High temperature storage testNo case deformation or change in appearance.
|L|/L10%
Temperature: 1252
Time: 1000 hours
Measurement at 244 hours after test conclusion.
Low temperature storage testNo case deformation or change in appearance.
|L|/L10%
Temperature: -402
Time: 1000 hours
Measurement at 244 hours after test conclusion.
Humidity testNo case deformation or change in appearance.
|L|/L10%
Temperature: 85, Humidity: 85% RH
Time: 1000 hours
Measurement at 244 hours after test conclusion.
Thermal shock testNo case deformation or change in appearance.
|L|/L10%
-40 for 30min to 125 for 30min as 1 cycle. Total 1000 cycles.
Solderability testTerminal area must have 90% min. solder coverage.Dip pads in flux then dip in solder pot at 2455 for 50.1 second.
Heat endurance of reflow solderingNo case deformation or change in appearance.
|L|/L10%
Refer to reflow curve, 3 times. Peak temperature: 260+5/-0.
Vibration testNo case deformation or change in appearance.
|L|/L10%
10~55Hz, 1.5mm amplitude in each of 3 directions for 2 hours each.
Drop testNo case deformation or change in appearance.
|L|/L10%
Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push testTerminal should not pull off.Apply 17.64N force for 10s.
Loading at High TemperatureNo case deformation or change in appearance.
|L|/L10%
Temperature: 852, Time: 1000 hours, Apply rated current. Measurement at 244 hours after test conclusion.

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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