SMD power inductor microgate MPIT252010-1R5N-LF designed for performance in various electronic circuits

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Product Description

SMD Power Inductor - MPIT252010 Series

This specification applies to the MPIT series of SMD power inductors manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. These inductors are designed for various electronic applications requiring efficient power management.

Product Attributes

Brand: MICROGATE
Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD, P.R.C
Product Series: MPIT252010 Series
Material: Ferrite Core (Ni-Zn Ferrite), Enameled Copper Wire, Ag/Ni/Sn/Cu Terminal Electrode, Epoxy resin and magnetic powder Magnetic Glue
Certifications: Lead free product (LF)

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR () Typ.	Isat 1 (A) Typ.	Irms 2 (A) Typ.	SRF (MHz) Typ.
MPIT252010-R47N-LF	0.4730%	0.056	2.50	2.15	201
MPIT252010-R68N-LF	0.6830%	0.074	2.20	1.80	139
MPIT252010-1R0N-LF	1.030%	0.108	1.85	1.50	100
MPIT252010-1R5N-LF	1.530%	0.182	1.80	1.20	80
MPIT252010-2R2N-LF	2.230%	0.209	1.20	1.10	60
MPIT252010-3R3M-LF	3.320%	0.328	1.05	0.85	49
MPIT252010-4R7M-LF	4.720%	0.564	1.00	0.65	40
MPIT252010-5R6M-LF	5.620%	0.564	0.80	0.65	37
MPIT252010-6R8M-LF	6.820%	0.896	0.78	0.58	32
MPIT252010-100M-LF	1020%	1.092	0.65	0.48	26

Product Dimensions

Model	A (mm)	B (mm)	C (mm)	D (mm)	E (mm)	f (mm)	g (mm)	h (mm)
MPIT252010	2.500.20	2.000.20	1.00Max.	0.800.2	0.800.2	0.80 Typ.	2.50 Typ.	2.00 Typ.

Test Conditions

Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa

Reference Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa

Operating Conditions

Ambient Temperature: -25 to +85
Allowed High Temperature: +125
Temperature Dependence: 40
Storage Temperature: -25 to +85
Storage Life: Half a year
Operating Ambient Frequency: 0.1MHz to 1MHz

Recommended Soldering Conditions

Suitable for flow and reflow soldering.

Flux: Rosin-based flux (halide content 0.2wt%)
Solder: Sn solder
Flow Soldering: Pre-heating temperature difference 150 (solder vs. product surface). Cooling into solvent after soldering should be gradual.