Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Surface Mount Multilayer Ceramic Capacitors Milliohm FN21X222K500PXG with Nickel Barrier Terminations

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Product Description

Product Overview

The FN Series General Purpose Multilayer Ceramic Chip Capacitors are designed for thick-film hybrid circuits and automatic surface mounting on printed circuit boards. Available in sizes from 0201 to 2225, these capacitors feature C0G, X7R, X5R, and Y5V dielectrics, with rated voltages up to 50Vdc. They offer high capacitance in a given case size and are equipped with lead-free, pure tin terminations for excellent solderability, preventing dissolution in molten solder. These capacitors are RoHS & HALOGEN compliant, making them suitable for general digital circuits, power supply bypass, consumer electronics, telecommunications, and DC to DC converters.

Product Attributes

  • Brand: POSPERITY (Implied by company name and product context)
  • Origin: Shenzhen, China (Implied by company address)
  • Termination: Nickel-barrier terminations with electroplated solder layer (pure Tin)
  • Compliance: RoHS & HALOGEN compliant

Technical Specifications

Category Specification Details
Product Name General Purpose Multilayer Ceramic Chip Capacitors FN Series
Part Number Prefix FN General purpose product
Sizes (EIA) 0201 to 2225 (0603 to 5763)
Dielectric Materials C0G, X7R, X5R, Y5V
Rated Voltage (UR) Up to 50Vdc Codes: 4R0 (4.0V), 6R3 (6.3V), 100 (10V), 160 (16V), 250 (25V), 500 (50V)
Capacitance Tolerance Various Codes: A (0.05pF), B (0.1pF), C (0.25pF), D (0.50pF), F (1%), G (2%), H (3%), J (5%), K (10%), L (0%~+10%), M (20%), N (-5%~+10%), X (+10%~+20%), Z (-20%~+80%)
Capacitance Range (Example for C0G) 0.1pF to 100nF (Refer to detailed tables for specific dielectric/voltage/size combinations)
Operating Temperature -55C to +125C (C0G)
-55C to +85C (X7R)
-25C to +85C (X5R)
-25C to +85C (Y5V)
Termination Features Nickel barrier layer, electroplated solder layer (pure Tin) Prevents dissolution in molten solder
Packaging Bulk, Tape & Reel (7"/10"/13" reels, Paper or Embossed Tape) Codes: B (Bulk), T (Tray), E (Tape/7" Reel, Embossed), P (Tape/7" Reel, Paper), K (Tape/10" Reel, Embossed), D (Tape/10" Reel, Paper), L (Tape/13" Reel, Embossed), G (Tape/13" Reel, Paper)
External Dimensions (Example: 0805) L: 2.000.20 mm
W: 1.250.20 mm
T: 0.500.20 mm
(Refer to Section 5 for detailed dimensions by size)
Reliability Tests Visual & Dimensions, Capacitance, Q/D.F., Temperature Coefficient, Insulation Resistance, Dielectric Strength, Solderability, Resistance to Soldering Heat, Temperature Cycle, Humidity (Steady State & Load), High Temperature Load, Adhesive Strength, Resistance to Flexure, Vibration Resistance (Refer to Section 8 for detailed conditions and requirements)
Application Notes Storage, Handling, Preheat, Soldering (Hand, Reflow, Wave), Cooling, Cleaning (Refer to Section 10 for detailed guidelines)

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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