Chip Capacitors muRata GRM155Z71A105KE01D 0402 Size X7R Temperature 1uF Capacitance Plus Minus 10 Percent Tolerance
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Product Description
Product Overview
Chip Multilayer Ceramic Capacitors for General Electronic Equipment. Designed for general-purpose applications, these capacitors offer reliable performance in a compact 0402 size with X7R temperature characteristics.
Product Attributes
- Brand: MURATA
- Material: Ceramic
Technical Specifications
| Part Number | Size Code | Temperature Characteristics | Nominal Capacitance | Capacitance Tolerance | Rated Voltage | Packaging |
| GRM155Z71A105KE01 | 0402 | X7R (MURATA) | 1uF | +/-10% | DC 10 V | 10000 pcs./Reel (180mm Reel) |
| GRM155Z71A105KE01 | 0402 | X7R (MURATA) | 1uF | +/-10% | DC 10 V | 40000 pcs./Reel (330mm Reel) |
| Item | Specification | Test Method |
| Rated Voltage | Max. voltage which may be applied continuously. | Shown in Rated value. |
| Dimension | 0.4 (L/W) x 0.2 (T) mm | Using Measuring instrument of dimension. |
| Voltage Proof | No defects or abnormalities. | Test Voltage: 250% of rated voltage, Applied Time: 1s to 5s |
| Insulation Resistance (I.R.) | More than 50F | Measurement Voltage: Rated Voltage, Charging Time: 1min |
| Capacitance | 1uF | Measurement Frequency: 1.0+/-0.1kHz, Measurement Voltage: 1.0+/-0.2Vrms |
| Q or Dissipation Factor (D.F.) | DF: 0.1 max. | Measurement Frequency: 1.0+/-0.1kHz, Measurement Voltage: 1.0+/-0.2Vrms |
| Capacitance Temperature Characteristics | Within +/-15% (-55 to +125) | No bias or 50% of rated voltage applied. |
| Adhesive Strength of Termination | No removal of the terminations or other defect. | Applied Force: 5N, Holding Time: 10+/-1s |
| Vibration | Appearance: No defects. Capacitance: Within specified initial value. Q or D.F.: Within specified initial value. | 10Hz to 55Hz to 10Hz, Total Amplitude: 1.5mm, Vibration Time: 2 hours in 3 directions. |
| Substrate Bending Test | Appearance: No defects. Capacitance: Within +/-10%. | Flexure: 1mm, Holding Time: 5+/-1s |
| Solderability | 95% of the terminations is to be soldered evenly and continuously. | Solder bath method, Sn-3.0Ag-0.5Cu, Test Temp: 245+/-5, Test Time: 2+/-0.5s |
| Resistance to Soldering Heat | Appearance: No defects. Capacitance Change: Within +/-15%. Q or D.F.: Within specified initial value. I.R.: Within specified initial value. Voltage Proof: No defects. | Solder bath method, Sn-3.0Ag-0.5Cu, Solder Temp: 270+/-5, Test Time: 10+/-0.5s |
| Temperature Sudden Change | Appearance: No defects. Capacitance Change: Within +/-7.5%. Q or D.F.: Within specified initial value. Voltage Proof: No defects. | 5 cycles of temperature extremes. |
| High Temperature High Humidity (Steady) | Appearance: No defects. Capacitance Change: Within +/-12.5%. Q or D.F.: DF: 0.2 max. I.R.: More than 500M or 12.5F (whichever is smaller). | Test Temperature: 40+/-2, Test Humidity: 90%RH to 95%RH, Test Time: 500+/-12h, Test Voltage: Rated Voltage |
| Durability | Appearance: No defects. Capacitance Change: Within +/-12.5%. Q or D.F.: DF: 0.2 max. I.R.: More than 1000M or 25F (whichever is smaller). | Test Temperature: Max. Operating Temp. +/-3, Test Time: 1000+/-12h, Test Voltage: 150% of rated voltage |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina