Film type chip common mode choke coil muRata DLP0NSN350HL2L for in DSI CSI UniPro interface circuits
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Product Description
Chip Common Mode Choke Coil DLP0NS Series
The DLP0NS Series Chip Common Mode Choke Coil is designed for noise suppression in various electronic applications. This series offers a film-type structure with compact dimensions, suitable for high-density mounting. It is ideal for applications requiring filtering of common mode noise, such as in MIPI D-PHY interfaces (DSI, CSI, UniPro).
Product Attributes
- Brand: MURATA MFG.CO., LTD
- Product Type: Chip Common Mode Choke Coil
- Structure: Film Type
- Polarity: No polarity
- Marking: No Marking
- Mass (Typical): 0.001g
Technical Specifications
| Murata Part Number | Common Mode Impedance (at 100MHz) | Rated Voltage | Rated Current | DC Resistance | Operating Temperature |
|---|---|---|---|---|---|
| DLP0NSN350HL2L | 3510% | 5V(DC) | 100mA | 1.225% | -40 to +85C |
| DLP0NSN350HL2B | 3510% | 5V(DC) | 100mA | 1.225% | -40 to +85C |
| DLP0NSN670HL2L | 67 20% | 5V(DC) | 110mA | 2.425% | -40 to +85C |
| DLP0NSN670HL2B | 67 20% | 5V(DC) | 110mA | 2.425% | -40 to +85C |
| DLP0NSN900HL2L | 90 20% | 5V(DC) | 100mA | 3.025% | -40 to +85C |
| DLP0NSN900HL2B | 90 20% | 5V(DC) | 100mA | 3.025% | -40 to +85C |
| DLP0NSN121HL2L | 120 20% | 5V(DC) | 90mA | 3.825% | -40 to +85C |
| DLP0NSN121HL2B | 120 20% | 5V(DC) | 90mA | 3.825% | -40 to +85C |
| DLP0NSC280HL2L | 2820% | 5V(DC) | 100mA | 1.325% | -40 to +85C |
| DLP0NSC280HL2B | 2820% | 5V(DC) | 100mA | 1.325% | -40 to +85C |
| DLP0NSC900HL2L | 9035% | 5V(DC) | 75mA | 4.030% | -40 to +85C |
| DLP0NSC900HL2B | 9035% | 5V(DC) | 75mA | 4.030% | -40 to +85C |
| Item | Specification | Test Method |
|---|---|---|
| Appearance and Dimensions | Meet item 5. | Visual Inspection and measured with Slide Calipers. |
| Solderability | The electrodes shall be at least 95% covered with new solder coating. | Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 15010C, 6090s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2403C Immersion Time : 30.5s Immersion and emersion rates : 25 mm / s |
| Resistance to Soldering Heat | Meet Table 1. | Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 15010C, 6090s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2705C Immersion Time : 51s Immersion and emersion rates : 25 mm / s Then measured arter exposure in the room condition for 4 to 48 hours. |
| Drop | It shall be dropped on concrete or steel board. | Method : free fall Height : 1m The Number of Times : 10 times |
| Vibration | It shall be soldered on the substrate. | Oscillation Frequency : 10 to 2000 to 10Hz for 15 minutes Total amplitude : 3.0 mm or Acceleration amplitude 196 m/s2 whichever is smaller. Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. |
| Bending Strength | Meet Table 2. | Substrate : (t =1.0 mm). Deflection : 3 mm Speed of Applying Force : 1.0 mm / s Keeping time : 5 seconds |
| Temperature Cycle | Meet Table 1. | 1 Cycle Step 1 -40C(+0C,-3C) / 30(+3,-0) min Step 2 Ordinary Temp. / within 3 min Step 3 +85(+3C,-0C) / 30(+3,-0) min Step 4 Ordinary Temp. / within 3 min Total of 100 cycles. Then measured after exposure in the room condition for 4 to 48 hours. |
| Humidity | Temperature : 402C Humidity : 90 to 95 % (RH) Time : 1000 hours(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. | |
| Heat life | Temperature : 852C Test Voltage : 2 times for Rated Voltage Time : 1000 hours(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. | |
| Cold Resistance | Temperature : -40 2C Time : 1000 hours(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina