Noise Filtering Chip EMIFIL LC Combined Monolithic muRata NFL21SP407X1C3D for Electronic Performance
Chip EMIFIL LC Combined Monolithic NFL21S Series
The Chip EMIFIL LC Combined Monolithic NFL21S Series is designed for noise suppression by conducting high-frequency noise elements to ground. It is suitable for applications requiring reliable noise filtering. The product is designed for solder mounting using reflow processes.
Product Attributes
- Brand: MURATA
- Product Type: Chip EMIFIL LC Combined Monolithic
- Series: NFL21S
- Plating: Sn plating (3, 7)
- Packaging Code: D (Taping), B (Bulk)
- RoHS Marking: ROHS Y ()
Technical Specifications
| MURATA Part Number | Cut-off Frequency [MHz] | Capacitance [pF] | Inductance (L) [nH] | DC Resistance [ max.] | Rated Current [mA(DC)] | Insulation Resistance [M min.] | Rated Voltage [V(DC)] | Withstanding Voltage [V(DC)] |
|---|---|---|---|---|---|---|---|---|
| NFL21SP106X1C3D | 10 | 67020% | 68020% | 8.5 | 100 | 1000 | 16 | 50 |
| NFL21SP106X1C3B | 10 | 67020% | 68020% | 8.5 | 100 | 1000 | 16 | 50 |
| NFL21SP206X1C7D | 20 | 24020% | 70020% | 150 | ||||
| NFL21SP206X1C7B | 20 | 24020% | 70020% | 150 | ||||
| NFL21SP506X1C3D | 50 | 8420% | 30520% | 3.5 | 150 | |||
| NFL21SP506X1C3B | 50 | 8420% | 30520% | 3.5 | 150 | |||
| NFL21SP706X1C3D | 70 | 7620% | 18520% | 3.0 | ||||
| NFL21SP706X1C3B | 70 | 7620% | 18520% | 3.0 | ||||
| NFL21SP107X1C3D | 100 | 4420% | 13520% | 2.0 | 200 | |||
| NFL21SP107X1C3B | 100 | 4420% | 13520% | 2.0 | 200 | |||
| NFL21SP157X1C3D | 150 | 2820% | 12820% | |||||
| NFL21SP157X1C3B | 150 | 2820% | 12820% | |||||
| NFL21SP207X1C3D | 200 | 2220% | 7220% | 1.5 | 250 | |||
| NFL21SP207X1C3B | 200 | 2220% | 7220% | 1.5 | 250 | |||
| NFL21SP307X1C3D | 300 | 1910% | 4510% | 1.2 | 300 | |||
| NFL21SP307X1C3B | 300 | 1910% | 4510% | 1.2 | 300 | |||
| NFL21SP407X1C3D | 400 | 1610% | 3410% | |||||
| NFL21SP407X1C3B | 400 | 1610% | 3410% | |||||
| NFL21SP507X1C3D | 500 | 1210% | 3110% | |||||
| NFL21SP507X1C3B | 500 | 1210% | 3110% |
Dimensions
(2) (1) (3)
1.250.1
0.850.1
2.00.2
0.30.2
0.60.2
0.30.2
1.250.1
0.40.2
0.250.2
Operating and Storage Temperature
- Operating Temperature: -55C to +125C (Includes self-heating.)
- Storage Temperature: -55C to +125C
Standard Testing Conditions
Temperature: Ordinary Temp. / 15 C to 35 C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
Packaging Specification (8mm-wide paper tape)
Packing quantity: 4000 pcs. / reel
Sprocket Hole: To the right as the tape is pulled toward the user.
Top tape pull strength: 5N min.
Bottom tape pull strength: 5N min.
Top tape peeling off force: 0.1N to 0.6N (typical)
Land Dimensions
Standard land dimensions for reflow:
0.6
1.4
2.6
0.8
2.3
0.6
1.9
Caution: Limitation of Applications
Contact manufacturer before using in applications requiring especially high reliability, including: Aircraft equipment, Aerospace equipment, Undersea equipment, Power plant control equipment, Medical equipment, Transportation equipment (automobiles, trains, ships, etc.), Traffic signal equipment, Disaster prevention / crime prevention equipment, Data-processing equipment, and applications of similar complexity or with reliability requirements comparable to the applications listed above.
Notice
Products can only be soldered with reflow. Use rosin-based flux (chlorine content not exceeding 0.2(wt)%) and Sn-3.0Ag-0.5Cu solder. Avoid highly acidic or water-soluble flux. Thermal shock: Pre-heating and cooling into solvent should limit temperature difference to 100C max. PCB bending: Design PCBs to avoid mechanical stress on products.
Get in Touch
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