Low ESL Multilayer Ceramic Capacitor 22000pF 50V muRata NFM21CC223R1H3D 3 Terminals for Noise Filtering
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Delivery Time:
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Product Description
Product Overview
The NFM21CC223R1H3 is a 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers excellent performance with low Equivalent Series Inductance (ESL), making it suitable for applications requiring effective noise filtering.
Product Attributes
- Brand: MURATA
- Part Number System: NFM 21 CC 223 R 1H 3
- Packaging: 180mm Reel PAPER W8P4 (4000 pcs./Reel)
- Certifications: JEMCPS-02213D
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Capacitance | 22000 pF 20 % | Frequency: 10.1kHz, Voltage: 10.2V(rms) |
| DC Rated Voltage | DC 50 V | Rated Voltage Time: 2 minutes max. |
| DC Resistance | 30mmax. | Measured with 100mA max. |
| Insulation Resistance | 1000Mmin. | Test Voltage: 150V(DC), Time: 1 to 5 s, Charge Current: 50mA max. |
| Operating /Storage Temp. Range | -55 to 125 C | |
| Dimensions (L x W x T) | 2.00.2 x 1.250.1 x 0.850.1 mm | |
| Termination Dimensions (e, d) | 0.30.2 x 0.2 min. | |
| Rated Current | 2A(DC) | |
| Appearance | No defects or abnormalities. | Visual inspection. |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. | Flux: Solution of rosin ethanol 25(mass)%, Pre-heat: 15010C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 2403C, Immersion Time: 31s |
| Resistance to soldering heat | Products shall be no failure after tested. | Flux: Solution of rosin ethanol 25(mass)%, Pre-heat: 15010C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 2705C, Immersion Time: 101s |
| Bending Strength | Deflection: 2mm, Keeping Time: 30s | Soldered on glass-epoxy substrate (t=1.0mm). |
| Drop | Height: 75cm, 3 directions | Free fall on concrete or steel board. |
| Bonding Strength | Applying Force (F): 9.8N, Applying Time: 30s | Soldered on glass-epoxy substrate. |
| Vibration | Oscillation Frequency: 10 to 55 to 10Hz for 1 minute, Double Amplitude: 1.5mm, Time: 2 hours in each of 3 mutually perpendicular directions. | Soldered on glass-epoxy substrate. |
| Temperature Cycling | -55+0/-3 / 30+3/-0 min to +125+3/-0 / 30+3/-0 min, 10 cycles | Soldered on glass-epoxy substrate. |
| Humidity | 402C, 90 to 95%(RH), 500+24/-0 hours | Soldered on glass-epoxy substrate. |
| Heat Life | 1252C, Rated Voltage x 200%, 1000+48/-0 hours | Soldered on glass-epoxy substrate. |
| Cold Resistance | -552C, 500+24/-0 hours | Soldered on glass-epoxy substrate. |
| Taping Specification | Base tape and Top tape have no spliced point. Sprocket holes are to the right. Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. | |
| Pull Strength of Top Tape and Bottom Tape | 5N min. | |
| Peeling off force of top tape | 0.1N to 0.6N (typical) | Speed of Peeling off: 300 mm / min |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina