Electronic Noise Suppression Chip EMIFIL LC muRata NFL18ST507X1C3D Combined Monolithic Type Component

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The NFL18ST_X Series is a Chip EMIFIL LC Combined Monolithic Type designed for noise suppression by conducting high-frequency noise elements to ground. It offers effective noise reduction when used with appropriate land dimensions and ground-plane connections.

Product Attributes

Brand: MURATA
Product Type: Chip EMIFIL LC Combined Monolithic Type
Series: NFL18ST_X
Certifications: RoHS compliant

Technical Specifications

MURATA Part Number	Customer Part Number	Dimension (L x W)	Cut-off Frequency [MHz]	Capacitance [pF]	Inductance (L) [nH]	DC Resistance [ max.]	Rated Current [mA(DC)]	Insulation Resistance [M min.]	Rated Voltage [V(DC)]	Withstanding Voltage [V(DC)]	Packaging Code
NFL18ST207X1C3D		1.6x0.8	200	2520%	11020%	3.5	150	1000	16	50	D
NFL18ST207X1C3B		1.6x0.8	200	2520%	11020%	3.5	150	1000	16	50	B
NFL18ST307X1C3D		1.6x0.8	300	1820%	6220%	1.8	200				D
NFL18ST307X1C3B		1.6x0.8	300	1820%	6220%	1.8	200				B
NFL18ST507X1C3D		1.6x0.8	500	1020%	4320%	1.5					D
NFL18ST507X1C3B		1.6x0.8	500	1020%	4320%	1.5					B

Item	Specification	Test Method
Operating Temperature	-55C to +125C (Includes self-heating.)
Storage Temperature	-55C to +125C
Capacitance (Cap.)	Meet item 3. Frequency : 10.1MHz Voltage : 10.2V(rms)
Inductance (L)	Frequency : 101MHz Voltage : 10.2V(rms)
DC Resistance (Rdc)	Meet item 3. Measured with 10mA max. Measured between terminal (1)-(3). (ref. Item5)
Insulation Resistance(I.R.)	Voltage : Rated Voltage Time : 1 minutes max.
Withstanding Voltage	Products shall not be damaged. Test Voltage : 50V(DC) Time : 1 to 5 s Charge Current : 50 mA max.
Appearance and Dimensions	Meet item 5.	Visual Inspection and measured with Slide Calipers.
Solderability	Electrodes shall be at least 90% covered with new solder coating. Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 10C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 3C Immersion Time : 31 s Immersion and emersion rates : 25mm / s
Resistance to soldering heat	Meet Table 1. Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 10C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 5C Immersion Time : 10 1 s Immersion and emersion rates : 25mm / s Then measured after exposure in the room condition for 242 hours.
Bending Strength	Meet Table 2. It shall be soldered on the glass-epoxy substrate (t = 1.0mm). Deflection : 2 mm Keeping Time : 30 s
Drop	Products shall be no failure after tested. It shall be dropped on concrete or steel board. Method : Free fall Height : 1m Attitude from which the product is dropped : 3 directions The Number of Time : 3 times for each direction (Total 9 times)
Bonding Strength	The electrodes shall be no failure after tested. It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8 N Applying Time : 30 s
Vibration	Meet Table 1. It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 55Hz for 1 minute Double Amplitude : 1.5 mm Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)
Temperature Cycling	Meet Table 1. 1 Cycle 1 step : -55 0 3 C / 30 3 0 min 2 step : Room Temperature / within 3 min 3 step : +125 3 0 C / 30 3 0 min 4 step : Room Temperature / within 3 min Total of 10 cycles Then measured after exposure in the room condition for 242 hours.
Humidity	Temperature : 40 2 C Humidity : 90 to 95%(RH) Time : 500 24 0 hours Then measured after exposure in the room condition for 242 hours.
Heat Life	Temperature : 125 2 C Test Voltage : Rated Voltage 200% Charge Current : 50 mA max. Time : 1000 48 0 hours Then measured after exposure in the room condition for 242 hours.