Chip EMIFIL Chip 3 terminal Capacitor muRata NFM18PC104R1C3D for Large Current Electronic Equipment

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Price: Negotiable

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Delivery Time: Negotiable

Product Description

Product Overview

The NFM18PC104R1C3 is a Chip EMIFIL Chip 3-terminal Capacitor for Large Current, designed for general electronic equipment. It offers reliable performance with specific electrical, mechanical, and environmental characteristics.

Product Attributes

Brand: MURATA
Packaging: 8mm-wide paper tape, 4000 pcs./Reel

Technical Specifications

Item	Specification	Test Method
Scope	Chip EMIFIL Chip 3-terminal Capacitor for Large Current for General Electronic equipment.
MURATA Part NO. System	NFM18PC104R1C3
Type & Dimensions	(Unit:mm) L:1.60.1, W:0.80.1, T:0.60.1, e:0.250.1, f:0.2 min.
Nominal Capacitance	0.1 uF
Capacitance Tolerance	20 %
DC Rated Voltage	DC 16 V
Rated Current	2A(DC)
DC Resistance	30mmax.
Insulation Resistance	1000Mmin.	JEMCPS-02211C
Operating /Storage Temp. Range	-55 to 125 C
Electrical Performance - Capacitance	0.1 uF	Frequency : 1.00.1kHz, Voltage : 10.2V(rms)
Electrical Performance - Withstanding Voltage	Rated Voltage x 300%	Time : 2 minutes max.
Electrical Performance - DC Resistance	Measured with 100mA max.
Electrical Performance - Operating Temperature	Shown in Rated value. Includes self-heating
Electrical Performance - Storage Temperature	Shown in Rated value.
Mechanical Performance - Appearance	No defects or abnormalities.	Visual inspection.
Mechanical Performance - Dimensions	Within the specified dimensions.	Using calipers.
Mechanical Performance - Solderability	Flux : Ethanol solution of rosin, 25(wt)%, Pre-heat : 15010C, 60 to 90s, Solder : Sn-3.0Ag-0.5Cu, Solder Temperature : 240 3C, Immersion Time : 31 s
Mechanical Performance - Resistance to soldering heat	Flux : Ethanol solution of rosin, 25(wt)%, Pre-heat : 15010C, 60 to 90s, Solder : Sn-3.0Ag-0.5Cu, Solder Temperature : 270 5C, Immersion Time : 10 1 s
Mechanical Performance - Bending Strength	Deflection : 2 mm, Keeping Time : 30 s	It shall be soldered on the glass-epoxy substrate (100401.0mm).
Mechanical Performance - Drop	Height : 1m	It shall be dropped on concrete or steel board. Attitude from which the product is dropped : 3 directions
Mechanical Performance - Bonding Strength	Applying Force (F) : 9.8 N, Applying Time : 10 s	It shall be soldered on the glass-epoxy substrate.
Mechanical Performance - Vibration	Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller.	It shall be soldered on the glass-epoxy substrate. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)
Environment Performance - Temperature Cycling	-55+0 / -3C / 30+3 / -0 min, Room Temperature / within 3 min, Maximum Operating Temperature +3 / -0C / 30 +3 / -0 min, Room Temperature / within 3 min	Total of 10 cycles
Environment Performance - Humidity	Temperature : 402C, Humidity : 90 to 95%(RH), Time : 500+24 / -0 hours
Environment Performance - Heat Life	Temperature : Maximum Operating Temperature 2 C, Test Voltage : Rated Voltage x 200%, Charge Current : 50 mA max., Time : 1000+48 / -0 hours
Packaging Code	R1C3
Packaging Unit	4000 pcs./Reel	W8P4