General Purpose Low ESL Large Current Capacitors muRata NFM41PC155B1E3L Multilayer Ceramic Chip Type

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This product specification is applied to Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) used for General Electronic equipment. These capacitors offer low ESL and are designed for general-purpose applications.

Product Attributes

Brand: MURATA
Part Number System Example: NFM41PC155B1E3
Packaging: 180mm Reel, EMBOSSED W12P4, 4000 pcs./Reel

Technical Specifications

Item	Specification	Test Method
Electrical Performance
Nominal Capacitance	1.5 ±0.3 μF	Frequency : 1.0±0.1KHz (Cap.) Voltage : 1±0.2V(rms)
Capacitance Tolerance	±20 %	-
DC Rated Voltage	DC 25 V	Rated Voltage Time : 2 minutes max.
Rated Current	6A(DC)	-
DC Resistance	9mΩmax.	Measured with 100mA max.
Insulation Resistance	300MΩmin.	-
Withstanding Voltage	Products shall not be damaged.	Test Voltage : Rated voltage x 250% Time : 1 to 5 s Charge Current : 50mA max.
Operating Temperature	-55 to 85 ℃	Shown in Rated value. Includes self-heating
Storage Temperature	-55 to 85 ℃	Shown in Rated value.
Mechanical Performance
Appearance	No defects or abnormalities.	Visual inspection.
Dimensions	Within the specified dimensions.	Using Measuring instrument of dimension.
Solderability	Electrodes shall be at least 95% covered with new solder coating.	Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 150±10℃, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240±3℃ Immersion Time : 3±1s Immersion and emersion rates : 25mm/s
Resistance to soldering heat	Products shall be no failure after tested.	Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 150±10℃, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270±5℃ Immersion Time : 10±1s Immersion and emersion rates : 25mm/s
Bending Strength	Meet Table 2.	It shall be soldered on the glass-epoxy substrate(t = 1.0mm). Deflection : 2mm Keeping Time : 30s
Drop	The electrodes shall be no failure after tested.	It shall be dropped on concrete or steel board. Method : Free fall Height : 1m The Number of Time : Total 10 times
Bonding Strength	-	It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8N Applying Time : 30s
Vibration	Meet Table 3.	It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude : 1.5 mm or Acceleration amplitude 196m/s² whichever is smaller. Time: 4 hours of the 3 directions for each.
Environment Performance
Temperature Cycling	Meet Table 4.	1 Cycle: -55+0/-3℃ / 30+3/-0 min, Room Temp. / within 3 min, +85+3/-0℃ / 30+3/-0 min, Room Temp. / within 3 min. Total of 10 cycles.
Humidity	Meet Table 5.	Temperature : 70±2℃ Humidity : 90 to 95%(RH) Time : 1000+48/-0 hours
Humidity Life	Meet Table 6.	Temperature : 70±2℃ Humidity : 90 to 95%(RH) Time : 500+24/-0 hours Test Voltage : Rated Voltage Test Current : Rated Current
Heat life	Meet Table 4.	Temperature : -85±2℃ Time : 1000+48/-0 hours Test Voltage : Rated Voltagex200% Test Current : Rated Current Change Current : 50A
Cold Resistance	Meet Table 6.	Temperature : -55±2℃ Time : 500+24/-0 hours
Dimensions (Unit:mm)
L	1.5±0.3	-
W	1.6±0.3	-
T	1.0±0.2	-
e	0.4±0.3	-
f	0.7 min.	-
Packaging Code	1E3 L	-

Standard Testing Condition

Unless otherwise specified
Temperature : Ordinary Temp. / 15 ℃ to 35 ℃
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa

In case of doubt
Temperature: 20 ℃ ± 2 ℃
Humidity: 60 %(RH) to 70 %(RH)