3 Terminals Low ESL Large Current Chip Multilayer Ceramic Capacitors muRata NFM15PC224D0J3D for General Electronic

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This product specification applies to Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) for General Electronic Equipment. These capacitors offer low ESL and are designed for general-purpose applications.

Product Attributes

Brand: MURATA
Product Line: NFM15PC Series
Type: Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL)

Technical Specifications

Item	Specification	Test Method
Electrical Performance
Nominal Capacitance	0.22 uF	Frequency : 1.0±0.1kHz (Cap.) Voltage : 1V±0.2V(rms)
Capacitance Tolerance	±20 %
DC Rated Voltage	DC 6.3 V	Time : 2 minutes max.
Rated Current	2A(DC)
DC Resistance	30mΩmax.	Measured with 100mA max.
Insulation Resistance	1000MΩmin.	Voltage : Rated Voltage x 300% Time : 1 to 5 s Charge Current : 50 mA max.
Operating /Storage Temp. Range	-55 to 105 °C
Mechanical Performance
Appearance	No defects or abnormalities.	Visual inspection.
Dimensions	Refer to drawing (Unit:mm)	Using calipers.
Solderability	Electrodes shall be at least 90% covered with new solder coating. Products shall be no failure after tested.	Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 ± 3°C Immersion Time : 3±1 s Immersion and emersion rates : 25mm / s
Resistance to soldering heat	Electrodes shall be no failure after tested.	Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150±10°C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5°C Immersion Time : 10 ± 1 s Immersion and emersion rates : 25mm / s
Bending Strength	Deflection : 1.0 mm	It shall be soldered on the glass-epoxy substrate (100×40×0.8mm). Deflection : 1.0 mm Keeping Time : 5 s
Drop	It shall be dropped on concrete or steel board.	Height : 1m Method : Free fall Attitude from which the product is dropped : 3 directions
Bonding Strength	Applying Force (F) : 5 N	It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 5 N Applying Time : 5 s
Vibration	Total amplitude 3.0 mm or Acceleration amplitude 196m/s² whichever is smaller.	It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude 3.0 mm or Acceleration amplitude 196m/s² whichever is smaller. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)
Environmental Performance
Temperature Cycling	1 Cycle	It shall be soldered on the glass-epoxy substrate. 1 Cycle 1 step : Minimum Operating Temperature +0 / -3°C / 30+3 / -0 min 2 step : Room Temperature / within 3 min 3 step : Maximum Operating Temperature +3 / -0°C / 30 +3 / -0 min 4 step : Room Temperature / within 3 min Total of 10 cycles
Humidity	Temperature : 40±2°C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours	It shall be soldered on the glass-epoxy substrate. Temperature : 40±2°C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours
Heat Life	Temperature : Maximum Operating Temperature ± 2 °C Test Voltage : Rated Voltage x 150% Time : 1000+48 / -0 hours	Temperature : Maximum Operating Temperature ± 2 °C Test Voltage : Rated Voltage x 150% Charge Current : 50 mA max. Time : 1000+48 / -0 hours
Dimensions (in mm)
L	1.0±0.1
W	0.5±0.2
T	0.4±0.1
e	0.17±0.1
g	0.1 min.
D	0.35±0.1
f	0.15±0.1
Packaging
Packaging Code	0J3
Unit	(7)
Reel	W8P2 180mm Reel PAPER
Quantity	10000 pcs./Reel