3 Terminals Low ESL Chip Capacitor muRata NFM21PC475B1A3D 4.7uF 10V Rated Current 6A for Electronics

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Delivery Time: Negotiable

Product Description

The NFM21PC475B1A3 is a Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers low ESL (Equivalent Series Inductance) and is suitable for applications requiring high current handling.

Product Attributes

Brand: MURATA
Packaging: 8mm-wide paper tape, 180mm Reel

Technical Specifications

Item	Specification	Test Method
Nominal Capacitance	4.7 uF	Frequency : 1.00.1kHz (Cap.) Voltage : 10.2V(rms)
Capacitance Tolerance	20 %	-
DC Rated Voltage	10 V	-
Rated Current (DC)	6A	-
DC Resistance	5mmax.	Measured with 100mA max.
Insulation Resistance	100Mmin.	Rated Voltage Time : 2 minutes max.
Operating /Storage Temp. Range	-40 to 85 C	-
Dimensions (L x W x T)	2.00.2 x 1.250.1 x 0.850.1 mm	-
Terminal Dimensions (e x d)	0.30.2 x 0.40.2 mm	-
Pitch (p)	0.60.2 mm	-
Packaging Unit	4000 pcs./Reel	-
Appearance	No defects or abnormalities.	Visual inspection.
Solderability	Electrodes shall be at least 90% covered with new solder coating. Products shall be no failure after tested.	Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 3C Immersion Time : 31 s Immersion and emersion rates : 25mm / s
Resistance to soldering heat	Appearance No damaged Cap. Change Within 7.5% DC Resistance 0.05max.	Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 5C Immersion Time : 10 1 s Immersion and emersion rates : 25mm / s
Bending Strength	Appearance No damaged Cap. Change Within 7.5% I.R. Meet the initial rated value. DC Resistance 0.05 max.	It shall be soldered on the glass-epoxy substrate (100401.0mm). Deflection : 2 mm Keeping Time : 30 s
Drop	Appearance No damaged Capacitance Meet the initial rated value. DC Resistance 0.05max.	It shall be dropped on concrete or steel board. Height : 75 cm Method : Free fall Attitude from which the product is dropped : 3 directions
Bonding Strength	-	It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8 N Applying Time : 30 s
Vibration	-	It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 minute Double Amplitude : 1.5 mm Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Preconditioning : Heat treatment (150+0 / -10 C,1hour)
Temperature Cycling	Appearance No damaged Cap. Change Within 12.5% I.R. 50F min. DC Resistance 0.05max.	It shall be soldered on the glass-epoxy substrate. 1 Cycle 1 step : Minimum Operating Temperature +0 / -3 C / 30+3 / -0 min 2 step : Room Temperature / within 3 min 3 step : Maximum Operating Temperature +3 / -0 C / 30 +3 / -0 min 4 step : Room Temperature / within 3 min Total of 10 cycles
Humidity	Appearance No damaged Cap. Change Within 12.5% I.R. 50F min. DC Resistance 0.05max.	It shall be soldered on the glass-epoxy substrate. Temperature : 402C Humidity : 90 to 95%(RH) Time : 500+24 / -0 hours
Heat Life	Appearance No damaged Cap. Change Within 12.5% I.R. 50F min. DC Resistance 0.05max.	Temperature : Maximum Operating Temperature 2 C Test Voltage : Rated Voltage x 200% Charge Current : 50 mA max. Time : 1000+48 / -0 hours
Taping Specification	Packing quantity : 4000 pcs. / reel. Pull Strength of Top Tape and Bottom Tape : 5N min. Peeling off force of top tape : 0.1N to 0.6N (minimum value is typical) Speed of Peeling off : 300 mm / min	-