Low ESL Chip Multilayer Ceramic Capacitor muRata NFM18CC101R1C3D for Noise Suppression Applications

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The NFM18CC101R1C3 is a 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers low Equivalent Series Inductance (ESL) and is suitable for applications requiring reliable filtering and noise suppression.

Product Attributes

Brand: MURATA
Packaging: 180mm Reel
Unit: 4000 pcs./Reel

Technical Specifications

Item	Specification	Test Method
Electrical Performance
Capacitance	100 pF	Frequency (Cap.) 100 to 22000pF : 10.1kHz, Voltage : 10.2V(rms)
Capacitance Tolerance	20 %
DC Rated Voltage	DC 16 V	Voltage : Rated Voltage Time : 2 minutes max.
Rated Current	500mA(DC)
DC Resistance	1000Mmin.	Measured with 100mA max.
Insulation Resistance(I.R.)	1000Mmin.	JEMCPS-02209D
Withstanding Voltage	Products shall not be damaged.	Test Voltage : Rated Voltage x 300% Time : 1 to 5 s Charge Current : 50mA max.
Operating Temperature	-55 to 125 C	Shown in Rated value. Includes self-heating
Storage Temperature	-55 to 125 C	Shown in Rated value.
Mechanical Performance
Appearance	No defects or abnormalities.	Visual inspection.
Dimensions	Within the specified dimensions.	Using Measuring instrument of dimension.
Solderability	Electrodes shall be at least 90% covered with new solder coating. Products shall be no failure after tested.	Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2403C Immersion Time : 31s Immersion and emersion rates : 25mm/s
Resistance to soldering heat	Products shall be no failure after tested.	Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2705C Immersion Time : 101s Immersion and emersion rates : 25mm/s
Bending Strength	Meet Table 2.	It shall be soldered on the glass-epoxy substrate(t=1.0mm). Deflection : 2mm Keeping Time : 30s
Drop	It shall be dropped on concrete or steel board.	Method : Free fall Height : 1m Attitude from which the product is dropped : 3 directions
Bonding Strength	The electrodes shall be no failure after tested.	It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8N Applying Time : 30s
Vibration	Meet Table 3.	It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)
Environment Performance
Temperature Cycling	Meet Table 1.	1 Cycle 1 step : -55+0/-3 / 30+3/-0 min 2 step : Room Temperature / within 3 min 3 step : +125+3/-0 / 30+3/-0 min 4 step : Room Temperature / within 3 min Total of 10 cycles
Humidity	Meet Table 4.	Temperature : 402C Humidity : 90 to 95%(RH) Time : 500+24/-0 hours
Heat Life		Temperature : 1252C Test Voltage : Rated Voltage x 200% Charge Current : 50mA max. Time : 1000+48/-0 hours
Cold Resistance		Temperature : -552C Time : 500+24/-0 hours
Packaging Specifications
Taping Dimensions (8mm-wide paper tape)	See diagram.
Packing quantity	4000 pcs. / reel
Missing components number	Within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous.
Pull Strength of Top Tape	5Nmin.
Peeling off force of top tape	0.1N to 0.6N (minimum value is typical)	Speed of Peeling off : 300 mm / min
Leader-tape, Trailer and Reel Dimensions	See diagram.