Noise suppression chip ferrite bead muRata BLM18SG121TN1D designed for in digital and DC power line circuits

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Product Description

Product Overview

The Chip Ferrite Bead BLM18_N Series offers effective impedance for noise suppression. Designed for various applications, these beads provide reliable performance in digital interfaces, DC power lines, and high-speed signal lines.

Product Attributes

Brand: MURATA
Origin: Japan (implied by MURATA MFG.CO., LTD.)
Operating Temperature: -55C to +125C
Storage Temperature: -55C to +125C
Marking: No marking

Technical Specifications

MURATA Part Number	Impedance () (at 100MHz)	Rated Current (mA)	DC Resistance ( max.)	Remark
BLM18RK121SN1D	12025%	200	0.25	For Digital Interface
BLM18RK221SN1D	22025%	200	0.30	For Digital Interface
BLM18RK471SN1D	47025%	200	0.50	For Digital Interface
BLM18RK601SN1D	60025%	200	0.60	For Digital Interface
BLM18RK102SN1D	100025%	200	0.80	For Digital Interface
BLM18PG300SN1D	20 min.	1000	0.05	For DC power line
BLM18PG330SN1D	3325%	3000*1	0.025	For DC power line
BLM18PG600SN1D	40 min.	1000	0.1	For DC power line
BLM18PG121SN1D	12025%	2000*1	0.05	For DC power line
BLM18PG181SN1D	18025%	1500*1	0.09	For DC power line
BLM18PG221SN1D	22025%	1400*1	0.10	For DC power line
BLM18PG331SN1D	33025%	1200*1	0.15	For DC power line
BLM18PG471SN1D	47025%	1000	0.20	For DC power line
BLM18KG221SN1D	22025	2200*1	0.050
BLM18KG331SN1D	33025	1700*1	0.080
BLM18KG471SN1D	47025	1500*1	0.130
BLM18KG601SN1D	60025	1300*1	0.150
BLM18SD220SN1D	2225	6000*1	0.008
BLM18SG330SN1D	3325	6000*1	0.008
BLM18AG121SN1D	12025%	800	0.18	For general use
BLM18AG151SN1D	15025%	700	0.25	For general use
BLM18AG221SN1D	22025%	700	0.25	For general use
BLM18AG331SN1D	33025%	600	0.30	For general use
BLM18AG471SN1D	47025%	550	0.35	For general use
BLM18AG601SN1D	60025%	500	0.38	For general use
BLM18AG102SN1D	100025%	450	0.50	For general use
BLM18BB050SN1D	525%	800	0.05	For high speed signal line
BLM18BA050SN1D	525%	500	0.2
BLM18BB100SN1D	1025%	700	0.10
BLM18BA100SN1D	1025%	500	0.25
BLM18BB220SN1D	2225%	700	0.20
BLM18BA220SN1D	2225%	500	0.35
BLM18BB470SN1D	4725%	600	0.25
BLM18BD470SN1D	4725%	500	0.3
BLM18BA470SN1D	4725%	300	0.55
BLM18BB600SN1D	6025%	600	0.25
BLM18BA750SN1D	7525%	300	0.70
BLM18BB750SN1D	7525%	600	0.30
BLM18BB121SN1D	12025%	550	0.30
BLM18BD121SN1D	12025%	300	0.4
BLM18BA121SN1D	12025%	200	0.9
BLM18BB141SN1D	14025%	500	0.35
BLM18BB151SN1D	15025%	450	0.37
BLM18BD151SN1D	15025%	300	0.4
BLM18BB221SN1D	22025%	450	0.45
BLM18BD221SN1D	22025%	250	0.45
BLM18BB331SN1D	33025%	400	0.58	For high speed signal line
BLM18BD331SN1D	33025%	250	0.5
BLM18BD421SN1D	42025%	250	0.55
BLM18BB471SN1D	47025%	300	0.85
BLM18BD471SN1D	47025%	250	0.55
BLM18BD601SN1D	60025%	200	0.65
BLM18BD102SN1D	100025%	200	0.85
BLM18BD152SN1D	150025%	150	1.2
BLM18BD182SN1D	180025%	150	1.5
BLM18BD222SN1D	220025%	150	1.5
BLM18BD252SN1D	250025%	150	1.5
BLM18TG121TN1D	12025%	200	0.25
BLM18TG221TN1D	22025%	200	0.3
BLM18TG601TN1D	60025%	200	0.45
BLM18TG102TN1D	100025%	100	0.6
BLM18SG260TN1D	2625	6000*1	0.007	For DC power line (Thin type)
BLM18SG700TN1D	7025	4000*1	0.020	For DC power line (Thin type)
BLM18SG121TN1D	12025	3000*1	0.025	For DC power line (Thin type)
BLM18SG221TN1D	22025	2500*1	0.040	For DC power line (Thin type)
BLM18SG331TN1D	33025	1500*1	0.070	For DC power line (Thin type)
BLM18SN220TN1D	227	8000*1	0.004
BLM18KG260TN1D	2625	6000*1	0.007
BLM18KG300TN1D	3025	5000*1	0.010
BLM18KG700TN1D	7025	3500*1	0.022
BLM18KG101TN1D	10025	3000*1	0.030
BLM18KG121TN1D	12025	3000*1	0.030

Item	Specification	Test Method
Appearance and Dimensions	Meet item 4.	Visual Inspection and measured with Slide Calipers.
Bonding Strength	Shall be soldered on the substrate. Applying Force(F) : 6.8N, Applying Time : 5s1s, Applied direction :Parallel to substrate	Table 1
Bending Strength	Shall be soldered on the substrate. Substrate: Glass-epoxy 100mm40mm1.6mm, Deflection : 1.0mm, Speed of Applying Force : 0.5mm/s, Keeping Time : 30s
Vibration	Shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min, Total Amplitude : 1.5mm, Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h)
Resistance to Soldering Heat	Appearance: No damage, Impedance Change (at 100MHz): Within 30% (for BLM18KG Within 40%) (for BLM18SN Within 50%), DC Resistance: Meet item 3. Pre-Heating : 150C10C, 60s90s, Solder : Sn-3.0Ag-0.5Cu, Solder Temperature : 270C5C, Immersion Time : 10s0.5s, Immersion and emersion rates : 25mm/s, Then measured after exposure in the room condition for 48h4h.	Table 2
Drop	Products shall be no failure after tested. It shall be dropped on concrete or steel board. Method : free fall, Height : 75cm, Attitude from which the product is dropped : 3 direction, The number of times : 3 times for each direction(Total 9 times)
Solderability	The electrodes shall be at least 95% covered with new solder coating. Flux : Ethanol solution of rosin,25(wt)%, Pre-Heating : 150C10C, 60s90s, Solder : Sn-3.0Ag-0.5Cu, Solder Temperature : 240C5C, Immersion Time : 3s1s, Immersion and emersion rates : 25mm/s

Item	Specification	Test Method
Temperature Cycle	Appearance: No damage, Impedance Change (at 100MHz): Within 30% (for BLM18KG Within-10%to +50%) (for BLM18SN Within 50%), DC Resistance: Meet item 3. 1 cycle: 1 step:-55 C(+0 C,-3 C) / 30min3min, 2 step:Ordinary temp. / 10min to 15min, 3 step:+125 C(+3 C,-0 C) / 30min3min, 4 step: Ordinary temp. / 10min to 15min, Total of 100 cycles, Then measured after exposure in the room condition for 48h4h.	Table 3
Humidity	Temperature : 40C2C, Humidity : 90%(RH) to 95%(RH), Time : 1000h(+48h,-0h), Then measured after exposure in the room condition for 48h4h.	Table 1
Heat Life	Temperature : 125C3C (in case of Rated current is more than 1A, do the test at : +85 C3C), Applying Current : Rated Current