Chip ferrite bead muRata BLM31KN102SN1L designed for electromagnetic noise suppression in electronics

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Product Description

Chip Ferrite Bead BLM31KN_SN Series

The Chip Ferrite Bead BLM31KN_SN Series is designed for noise suppression applications. These components are ideal for use in various electronic circuits where filtering of unwanted high-frequency noise is critical. Their compact size and high performance make them suitable for densely populated PCBs.

Product Attributes

Brand: MURATA MFG.CO., LTD.
Product ID: BLM
Type: KN_SN Series
Packaging: L (Taping) / B (Bulk)

Technical Specifications

MURATA Part Number	Impedance () (at 100MHz)	Rated Current (mA)	DC Resistance () max.	Operating Temperature (C)	Dimensions (LW) (mm)	Unit Mass (g)
BLM31KN121SN1L	12025%	6000	0.009	-55 to +125	3.2 x 1.6	0.041
BLM31KN121SN1B	12025%	6000	0.009	-55 to +125	3.2 x 1.6	0.041
BLM31KN271SN1L	27025%	4500	0.016	-55 to +125	3.2 x 1.6	0.041
BLM31KN271SN1B	27025%	4500	0.016	-55 to +125	3.2 x 1.6	0.041
BLM31KN471SN1L	47025%	4000	0.02	-55 to +125	3.2 x 1.6	0.041
BLM31KN471SN1B	47025%	4000	0.02	-55 to +125	3.2 x 1.6	0.041
BLM31KN601SN1L	60025%	2900	0.038	-55 to +125	3.2 x 1.6	0.041
BLM31KN601SN1B	60025%	2900	0.038	-55 to +125	3.2 x 1.6	0.041
BLM31KN801SN1L	80025%	2500	0.05	-55 to +125	3.2 x 1.6	0.041
BLM31KN801SN1B	80025%	2500	0.05	-55 to +125	3.2 x 1.6	0.041
BLM31KN102SN1L	100025%	2000	0.075	-55 to +125	3.2 x 1.6	0.041
BLM31KN102SN1B	100025%	2000	0.075	-55 to +125	3.2 x 1.6	0.041

Environmental Performance Summary

Test Item	Specification
Temperature Cycle	100 cycles, -55C to +125C
Humidity	40C, 90-95% RH, 1000h
Heat Life	85C, Rated Current, 1000h
Cold Resistance	-55C, 1000h

Packaging Specification

Item	Specification
Tape Width	8mm
Pitch	4mm
Quantity per Reel	2500 pcs. / reel (180mm reel)
Plastic Tape Pull Strength	5N min.
Cover Tape Pull Strength	10N min.
Cover Tape Peeling off force	0.2N to 0.7N

Cautions

Excessive surge current can lead to product failure.
Consult Murata before using in high-reliability applications such as aircraft, medical, or transportation equipment.

Notice

Designed for solder mounting. Consult for alternative mounting methods.
Standard land pattern dimensions for reflow soldering are provided.
Recommended soldering conditions for reflow soldering are detailed, including flux, solder type, and temperature profiles.