Electronic circuits noise suppression chip ferrite bead muRata BLM15EX331SN1D with impedance features
Chip Ferrite Bead BLM15ESN1
The BLM15E_SN series chip ferrite beads are designed for noise suppression in electronic circuits. They offer effective impedance at high frequencies, making them suitable for general use in a wide range of applications.
Product Attributes
- Brand: MURATA
- Product ID: BLM15E
- Packaging: Taping (D) / Bulk (B)
Technical Specifications
| MURATA Part Number | Impedance () (at 100MHz) | Impedance () (at 1GHz) | Rated Current (mA) | DC Resistance ( max.) | Remark |
| BLM15EG121SN1D | 12025% | 145 | 1500*1 | 0.095 | For general use |
| BLM15EG121SN1B | 12025% | 145 | 1500*1 | 0.095 | For general use |
| BLM15EG221SN1D | 22025% | 270 | 700*1 | 0.28 | |
| BLM15EG221SN1B | 22025% | 270 | 700*1 | 0.28 | |
| BLM15EX121SN1D | 12025% | 17040% | 1800*1 | 0.075 | |
| BLM15EX121SN1B | 12025% | 17040% | 1800*1 | 0.075 | |
| BLM15EX221SN1D | 22025% | 30040% | 1300*1 | 0.140 | |
| BLM15EX221SN1B | 22025% | 30040% | 1300*1 | 0.140 | |
| BLM15EX331SN1D | 33025% | 45040% | 1100*1 | 0.205 | |
| BLM15EX331SN1B | 33025% | 45040% | 1100*1 | 0.205 | |
| BLM15EX471SN1D | 47025% | 63040% | 950*1 | 0.280 | |
| BLM15EX471SN1B | 47025% | 63040% | 950*1 | 0.280 |
Operating and Storage Conditions
Operating Temperature: -55C to +125C
Storage Temperature: -55C to +125C
Standard Testing Conditions
Temperature: Ordinary Temp. (15 C to 35 C) or 20C2 C
Humidity: Ordinary Humidity (25%(RH) to 85%(RH)) or 60%(RH) to 70%(RH)
Atmospheric pressure: 86kPa to 106kPa
Mechanical Performance
| Item | Specification |
| Unit Mass (Typical value) | 0.001g |
| Appearance and Dimensions | Visual Inspection and measured with Slide Calipers. |
| Bonding Strength | Impedance Change (at 100MHz): Within 30%; DC Resistance: Meet item 3. |
| Bending Strength | Deflection: 2.0mm |
| Vibration | Oscillation Frequency: 10Hz to 2000Hz to 10Hz for 20 min; Total Amplitude 1.5mm or Acceleration 196m/s2 whichever is smaller |
| Resistance to Soldering Heat | Pre-Heating: 150C10C, 60s90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temperature: 270C5C; Immersion Time: 10s0.5s |
| Drop | Free fall from 75cm onto concrete or steel board, 3 directions, 3 times each direction. |
| Solderability | Electrodes shall be at least 95% covered with new solder coating. |
Environmental Performance
| Item | Specification |
| Heat Shock | 500 cycles of -55C (30min) to +125C (30min) |
| Humidity | 70C2C, 90%RH to 95%RH for 1000h |
| Heat Life | 125C3C with Rated Current for 1000h |
| Cold Resistance | -552C for 1000h |
Packaging Specification
8mm-wide paper tape, 2mm-pitch. Standard quantity per reel: 10000 pcs. / 180mm reel.
Caution
Excessive surge current may cause critical failure. Contact manufacturer before applying surge current. Consult manufacturer before using in high-reliability applications such as aircraft, medical, or transportation equipment.
Notice
Designed for solder mounting. Consult manufacturer for alternative mounting methods. Standard land dimensions and reflow soldering conditions are provided for BLM15EG and BLM15EX series.
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