Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Low ESL Multilayer Ceramic Capacitor muRata NFM18PS105D0J3D 1uF 6.3V DC Rated Voltage for Electronics

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The NFM18PS105D0J3 is a Large Current & High Insertion Loss 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers a capacitance of 1uF with a DC rated voltage of 6.3V and a capacitance tolerance of 20%. This capacitor is characterized by its low ESL and suitability for high current applications.

Product Attributes

  • Brand: MURATA
  • Part Number: NFM18PS105D0J3
  • Packaging Code: 3
  • Reel Size: 180mm
  • Packaging Unit: 4000 pcs./Reel

Technical Specifications

ItemSpecificationTest Method
Nominal Capacitance1 uF
Capacitance Tolerance20 %
DC Rated VoltageDC 6.3 V
Rated Current (DC)2A(DC)
DC Resistance30mmax.Measured with 100mA max.
Insulation Resistance500Mmin.Rated Voltage x 300% Time : 2 minutes max.
Operating Temp. Range-55 to 125 C
Storage Temp. Range-55 to 125 C
Dimensions (L x W x T)1.60.1 x 0.80.1 x 0.60.1 mm
Dimensions (e1, e2)0.15+0.2/-0.1 mm
Dimensions (i)0.40.1 mm
Dimensions (g)0.8+0.2/-0.1 mm
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 3C Immersion Time : 31 s
Resistance to soldering heatAppearance No damaged, Cap. Change Within 7.5%, DC Resistance 0.05 max.Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 5C Immersion Time : 10 1 s
Bending StrengthDeflection : 1 mm Keeping Time : 30 sIt shall be soldered on the glass-epoxy substrate (100400.8mm).
DropHeight : 1m, Number of Time : 10 timesIt shall be dropped on concrete or steel board. Method : Free fall
Bonding StrengthApplying Force (F) : 5 N, Applying Time : 10 sIt shall be soldered on the glass-epoxy substrate.
VibrationTotal amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time : A period of 6 hours in each of 3 mutually perpendicular directions.It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute.
Temperature Cycling10 cycles1 Cycle 1 step : Minimum Operating Temperature +0 / -3 C / 30+3 / -0 min, 2 step : Room Temperature / within 3 min, 3 step : Maximum Operating Temperature +3 / -0 C / 30 +3 / -0 min, 4 step : Room Temperature / within 3 min
Humidity500+24 / -0 hoursTemperature : 402C, Humidity : 90 to 95%(RH)
Heat Life1000+48 / -0 hoursTemperature : Maximum Operating Temperature 2 C, Test Voltage : (474R/105R)Rated Voltage x 200% (105D) Rated Voltage x 150%
Pull Strength of Top Tape5Nmin.(Only for NFM18PS, 8Nmin.)
Peeling off force of top tape0.1N to 0.6N (minimum value is typical) Speed of Peeling off : 300 mm / min

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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