High impedance chip ferrite bead muRata BLM21PG600SN1D for DC power line noise suppression solutions

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Price: Negotiable

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Delivery Time: Negotiable

Product Description

Product Overview

The Murata Chip Ferrite Bead BLM21_N Series offers effective noise suppression for various applications. These components are designed for DC power lines, digital interfaces, and high-speed signal lines, providing impedance characteristics suitable for each scenario. They are manufactured by Murata Manufacturing Co., Ltd. and are intended for professional use.

Product Attributes

Brand: Murata
Origin: Japan (implied by Murata Mfg. Co., Ltd.)
Certifications: Not specified in the provided text.
Material: Ferrite (implied by Chip Ferrite Bead)
Color: Not specified in the provided text.

Technical Specifications

MURATA Part Number	Impedance () (at 100MHz)	Rated Current (mA)	DC Resistance () max. (Initial)	DC Resistance () max. (After Testing)	Remark
BLM21PG220SN1D	2225%	6000	0.009	0.018	For DC power line
BLM21PG300SN1D	30 min.	4000	0.014	0.028	For DC power line
BLM21PG600SN1D	6025%	3500	0.02	0.04	For DC power line
BLM21PG121SN1D	12025%	3000	0.03	0.06	For DC power line
BLM21PG221SN1D	22025%	2000	0.045	0.09	For DC power line
BLM21PG331SN1D	33025%	1500	0.07	0.14	For DC power line
BLM21SN300SN1D	3010	8500	0.004	0.005
BLM21RK121SN1D	12025%	200	0.15	0.25	For Digital Interface
BLM21RK221SN1D	22025%	200	0.20	0.30	For Digital Interface
BLM21RK471SN1D	47025%	200	0.25	0.35	For Digital Interface
BLM21RK601SN1D	60025%	200	0.30	0.40	For Digital Interface
BLM21RK102SN1D	100025%	200	0.50	0.60	For Digital Interface
BLM21BB050SN1D	525	1000	0.02	0.04	For high speed signal line
BLM21BB600SN1D	6025	800	0.13	0.23	For high speed signal line
BLM21BB750SN1D	7525	700	0.16	0.26	For high speed signal line
BLM21BB121SN1D	12025	600	0.19	0.29	For high speed signal line
BLM21BD121SN1D	12025	350	0.25	0.35	For high speed signal line
BLM21BB151SN1D	15025	600	0.21	0.31	For high speed signal line
BLM21BD151SN1D	15025	350	0.25	0.35	For high speed signal line
BLM21BB201SN1D	20025	500	0.26	0.36	For high speed signal line
BLM21BB221SN1D	22025	500	0.26	0.36	For high speed signal line
BLM21BD221SN1D	22025%	350	0.25	0.35	For high speed signal line
BLM21BB331SN1D	33025	400	0.33	0.43	For high speed signal line
BLM21BD331SN1D	33025%	300	0.3	0.4	For high speed signal line
BLM21BD421SN1D	42025%	300	0.3	0.4	For high speed signal line
BLM21BB471SN1D	47025	400	0.40	0.50	For high speed signal line
BLM21BD471SN1D	47025%	300	0.35	0.45	For high speed signal line
BLM21BD601SN1D	60025%	300	0.35	0.45	For high speed signal line
BLM21BD751SN1D	75025%	250	0.4	0.5	For high speed signal line
BLM21BD102SN1D	100025%	250	0.4	0.5	For high speed signal line
BLM21BD152SN1D	150025%	250	0.45	0.55	For high speed signal line
BLM21BD182SN1D	180025%	250	0.5	0.6	For high speed signal line
BLM21BD222SN1L	1600 min.	250	0.6	0.7	For high speed signal line
BLM21BD222TN1D	220025%	200	0.6	0.7	For high speed signal line
BLM21BD272SN1L	270025%	200	0.8	0.9	For high speed signal line
BLM21AG121SN1D	12025	1000	0.09	0.19	For general use
BLM21AG151SN1D	15025	1000	0.09	0.19	For general use
BLM21AG221SN1D	22025	900	0.12	0.22	For general use
BLM21AG331SN1D	33025	800	0.15	0.25	For general use
BLM21AG471SN1D	47025	700	0.18	0.28	For general use
BLM21AG601SN1D	60025	700	0.2	0.3	For general use
BLM21AG102SN1D	100025	600	0.27	0.37	For general use

Item	Specification	Test Method
Operating Temperature	-55C to +125C
Storage Temperature	-55C to +125C
Impedance Measurement	Measuring Frequency: 100MHz1MHz	Agilent4291A or equivalent, Agilent16192A or equivalent
DC Resistance Measurement	Except resistance of the Substrate and Wire	Digital multi meter
Bonding Strength	Appearance: No damage, Impedance Change (at 100MHz): Within 30%, DC Resistance: Meet item 3.	Soldered on substrate. Applying Force(F): 9.8N, Applying Time: 5s1s, Applied direction: Parallel to substrate
Bending Strength	Appearance: No damage, Impedance Change (at 100MHz): Within 30% (for BLM21SN Within 50%), DC Resistance: Meet item 3.	Soldered on substrate. Substrate: Glass-epoxy 100mm40mm1.6mm, Deflection: 1.0mm, Speed of Applying Force: 0.5mm/s, Keeping Time: 30s
Vibration		Soldered on substrate. Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min, Total Amplitude: 1.5mm, Testing Time: 2 hours in each of 3 mutually perpendicular directions (Total 6 h)
Resistance to Soldering Heat	Appearance: No damage, Impedance Change (at 100MHz): Within 30% (for BLM21SN Within 50%), DC Resistance: Meet item 3.	Pre-Heating: 150C10C, 60s90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temperature: 270C5C; Immersion Time: 10s0.5s; Immersion and emersion rates: 25mm/s. Measured after 48h4h at room condition.
Drop Test	No failure after tested.	Free fall onto concrete or steel board. Height: 75cm, Attitude: 3 directions, Number of times: 3 times for each direction (Total 9 times)
Solderability	Electrodes shall be at least 95% covered with new solder coating.	Flux: Ethanol solution of rosin, 25(wt)%; Pre-Heating: 150C10C, 60s90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temperature: 240C5C; Immersion Time: 4s1s; Immersion and emersion rates: 25mm/s
Temperature Cycle		Soldered on substrate. 1 cycle: -55C (30min) -> Ordinary temp. (10-15min) -> +125C (30min) -> Ordinary temp. (10-15min). Total 100 cycles. Measured after 48h4h at room condition.
Humidity Test		Temperature: 40C2C, Humidity: 90% to 95% RH, Time: 1000h(+48h,-0h). Measured after 48h4h at room condition.
Heat Life Test		Temperature: 125C3C (or 85C3C if Rated current > 1A), Applying Current: Rated Current, Time: 1000h(+48h,-0h). Measured after 48h4h at room condition.
Cold Resistance Test		Temperature: -55C2C, Time: 1000h(+48h,-0h). Measured after 48h4h at room condition.