MWI Series Wire Wound Chip Inductor MWI0402IF6R8KST-HF with Performance and Environmental Compliance

Product Overview

The MWI0402IF series wire wound chip inductors are designed for various electronic applications. These components offer precise inductance values, low DC resistance, and high current handling capabilities. They are suitable for use in a wide range of electronic circuits requiring reliable inductive components. The series is available in multiple inductance values and tolerances, with options for lead-free and halogen-free environmental compliance.

Product Attributes

• Brand: Ming Yixuan Electronic Technology Co., LTD (DongGuan Ming Yixuan Electronic Technology Co., LTD)
• Product Line: MWI0402IF Series
• Type: Wire Wound Chip Inductor
• Environmental Compliance: LF (Lead Free), HF (Halogen Free)
• Origin: Dongguan, Guangdong, China

Technical Specifications

Shape & Dimension (Unit: mm)

Part Numbering System

MWI 0402 IF R47 K S T - HF

1. Product Symbol: MWI
2. Dimensions: 0402
3. Chip Type: IF
4. Inductance: e.g., R47 (0.47uH), 22N (22nH)
5. Tolerance: J (5%), K (10%), M (20%)
6. Terminal: S (Tin terminal)
7. Packaging: T (Tape & Reel), B (Bulk)
8. Environmental: LF (Lead Free), HF (Halogen Free), FP (Red Phosphor Free)

Electrical Characteristics

Represents product tolerance: J 5%; K 10%; M 20%

Test Remarks:

• All test data is referenced to 25 ambient.
• Isat: DC current at which inductance drops approximate 30% from its value without current.
• Irms: DC current that causes the temperature rise (T 40 ) from 25 ambient.

General Specification

• Operating Temperature: -40 ~ +85 (Including self-generated heat).
• Storage Temperature: -10 ~ +40 R.H.: 60% Max.
• Moisture Sensitivity Level (MSL): 1
• Recommended products should be used within 12 months from the date of delivery.
• The part temperature (ambient + temp rise) should not exceed 85 C under worst-case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Soldering Conditions

Re-flow Soldering (Lead Free)

• Preheat circuit and products to 150.
• 260 tip temperature (Max).
• Reflow times: no more than 2 times.
• Solder paste thickness: the best is 0.08mm, but max is 0.1mm.

Hand Soldering

• Use a 20 watt soldering iron with tip diameter of 1.0mm.
• Limit soldering time to 3 sec.

Package Specification

Packaging Quantity: 10000Pcs/Reel

Package Specifications (Inside Box And Outside Carton)