Compact chip ferrite bead muRata BLM31KN121SN1L for signal integrity in general electronic equipment
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MURATA MFG CO., LTD CHIP FERRITE BEAD BLM31KN_SN series is designed for general electronic equipment. These chip ferrite beads are crucial components for noise suppression and signal integrity in various electronic circuits. Their compact size and reliable performance make them suitable for a wide range of applications.
Product Attributes
- Brand: MURATA MFG CO., LTD
- Product ID: BLM31KN_SN series
- Origin: Not specified
- Material: Ferrite
- Color: Not specified
- Certifications: RoHS marking indicated
Technical Specifications
| Murata Part Number | Impedance () at 100 MHz | Rated Current*1 (mA) (Ambient 85C) | Rated Current*1 (mA) (Ambient 125C) | DC Resistance () max. (Initial) | DC Resistance () max. (After testing) | Operating Temperature Range | Storage Temperature Range |
| BLM31KN121SN1L | 12025% | 6000 | 4000 | 0.009 | 0.011 | -55C to +125C | -55C to +125C |
| BLM31KN271SN1L | 27025% | 4500 | 3000 | 0.016 | 0.019 | -55C to +125C | -55C to +125C |
| BLM31KN471SN1L | 47025% | 4000 | 2700 | 0.02 | 0.024 | -55C to +125C | -55C to +125C |
| BLM31KN601SN1L | 60025% | 2900 | 2000 | 0.038 | 0.045 | -55C to +125C | -55C to +125C |
| BLM31KN801SN1L | 80025% | 2500 | 1700 | 0.05 | 0.06 | -55C to +125C | -55C to +125C |
| BLM31KN102SN1L | 100025% | 2000 | 1400 | 0.075 | 0.09 | -55C to +125C | -55C to +125C |
| Item | Specification | Test Method |
| Unit mass (typical value) | 0.041 g | Not specified |
| Appearance and Dimensions | Meet chapter 5 | Visual inspection and measured with slide calipers. |
| Shear test (Appearance) | No significant mechanical damage shall be observed. | Applying force: 9.8 N, Holding time: 5 s1 s |
| Shear test (Impedance change rate at 100 MHz) | within 30% | Not specified |
| Shear test (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Bending test (Appearance) | No significant mechanical damage shall be observed. | Test substrate: glass-epoxy substrate (100 mm 40 mm 1.6 mm), Pressure jig: R340, Deflection: 1.0 mm, Holding time: 30 s |
| Bending test (Impedance change rate at 100 MHz) | within 30% | Not specified |
| Bending test (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Vibration (Appearance) | No significant mechanical damage shall be observed. | Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for 1 min, Total amplitude: 1.5 mm, Test time: 3 directions, 2 h each |
| Vibration (Impedance change rate at 100 MHz) | within 30% | Not specified |
| Vibration (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Resistance to soldering heat (Reflow) (Appearance) | No significant mechanical damage shall be observed. | Solder: Sn-3.0Ag-0.5Cu solder, Peak temperature: 260C, Number of reflow cycles: 2 times |
| Resistance to soldering heat (Reflow) (Impedance change rate at 100 MHz) | within 50% | Not specified |
| Resistance to soldering heat (Reflow) (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Drop (Appearance) | No significant mechanical damage shall be observed. | Method: free fall, Height: 75 cm, Number of times: 3 times for each of 3 directions |
| Solderability | 95% or more of the outer electrode shall be covered with new solder seamlessly. | Flux: ethanol solution with 25(wt)% rosin, Solder: Sn-3.0Ag-0.5Cu solder, Solder temperature: 240C5C, Immersion time: 4 s1 s |
| Temperature cycle (Appearance) | No significant mechanical damage shall be observed. | 100 cycles: -55C (30 min) to +125C (30 min) with 10-15 min at ordinary temperature between steps. |
| Temperature cycle (Impedance change rate at 100 MHz) | within 50% | Not specified |
| Temperature cycle (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Humidity (Appearance) | No significant mechanical damage shall be observed. | 40C2C, 90% (RH) to 95% (RH), 1000 h |
| Humidity (Impedance change rate at 100 MHz) | within 50% | Not specified |
| Humidity (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Heat life (Appearance) | No significant mechanical damage shall be observed. | 85C3C, Rated current applied, 1000 h |
| Heat life (Impedance change rate at 100 MHz) | within 50% | Not specified |
| Heat life (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Cold resistance (Appearance) | No significant mechanical damage shall be observed. | -55C2C, 1000 h |
| Cold resistance (Impedance change rate at 100 MHz) | within 50% | Not specified |
| Cold resistance (DC resistance) | Meet chapter 3 ratings. | Not specified |
| Packaging Type | Dimensions (mm) | Packing Quantity |
| 8 mm width/plastic tape | A: 1.90.1, B: 3.50.1, t: 1.750.1, t': 0.20.1 | 2500 pcs/reel |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina