Noise Suppression Ferrite Bead muRata BLM03HD152FN1D for Electronic Signal Line Applications

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The MURATA Chip Ferrite Bead BLM03H__N Series is designed for general use and high-speed signal lines, offering effective impedance control. These components are crucial for suppressing noise in electronic circuits and are suitable for various demanding applications.

Product Attributes

Brand: MURATA
Origin: Japan (implied by MURATA MFG.CO.,LTD.)
Certifications: RoHS marking (ROHS-Y)

Technical Specifications

MURATA Part Number	Impedance () at 100MHz	Impedance () at 1GHz	Rated Current (mA)	DC Resistance ( max.)	Remark
BLM03HG601SN1D	60025%	100040%	150	1.6	For general use
BLM03HG601SN1B	60025%	100040%	150	1.7	For general use
BLM03HG102SN1D	100025%	180040%	125	2.6
BLM03HG102SN1B	100025%	180040%	125	2.7
BLM03HG122SN1D	120025%	200040%	100	3.5
BLM03HG122SN1B	120025%	200040%	100	3.6
BLM03HB191SN1D	19025%	115040%	150	2.0
BLM03HB191SN1B	19025%	115040%	150	2.1
BLM03HB401SN1D	40025%	185040%	125	2.8
BLM03HB401SN1B	40025%	185040%	125	2.9
BLM03HD331SN1D	33025%	75040%	200	1.0	For High speed Signal line
BLM03HD331SN1B	33025%	75040%	200	1.1	For High speed Signal line
BLM03HD471SN1D	47025%	100040%	175	1.3
BLM03HD471SN1B	47025%	100040%	175	1.4
BLM03HD601SN1D	60025%	150040%	150	1.7
BLM03HD601SN1B	60025%	150040%	150	1.8
BLM03HD102SN1D	100025%	230040%	120	2.9
BLM03HD102SN1B	100025%	230040%	120	3.0
BLM03HD102FN1D	100025%	230040%	135	2.4
BLM03HD102FN1B	100025%	230040%	135	2.5
BLM03HD152FN1D	150025%	270040%	120	3.1
BLM03HD152FN1B	150025%	270040%	120	3.2
BLM03HD182FN1D	180025%	300040%	100	3.8
BLM03HD182FN1B	180025%	300040%	100	3.9

Electrical Performance

Item	Specification	Test Method
Impedance	Meet item 3. Measuring Frequency : 100MHz1MHz , 1GHz1MHz	Measuring Equipment : KEYSIGHT 4991A or the equivalent Test Fixture : KEYSIGHT 16197A or the equivalent
DC Resistance	Meet item 3.	Digital multi meter *Except resistance of the Substrate and Wire

Mechanical Performance

Item	Specification	Test Method
Appearance and Dimensions	Meet item 4.	Visual Inspection and measured with Measuring Microscope.
Bending Strength	It shall be soldered on the Glass-epoxy substrate. Substrate : 100mm40mm0.8mm Deflection : 1.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s	Table 1.
Vibration	It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20 min Total Amplitude 1.5mm or Acceleration 196m/s2 whichever is smaller Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h)
Resistance to Soldering Heat	Pre-Heating : 150C10C, 60s90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270C5C Immersion Time : 10s0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h4h.
Solderability	The electrodes shall be at least 95% covered with new solder coating. Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150C10C, 60s90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240C5C Immersion Time : 3s1s Immersion and emersion rates : 25mm/s Appearance No damage Impedance Change (at 100MHz) Within 30% DC Resistance Meet item 3.

Environmental Performance

Item	Specification	Test Method
Temperature Cycle	1 cycle : 1 step : -55 C(+0 C,-3 C) / 30min3min 2 step : Ordinary temp. / 10min to 15min 3 step : +125 C(+3 C,-0 C) / 30min3min 4 step : Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h4h.	Table 1. It shall be soldered on the substrate.
Humidity	Temperature : 70C2C Humidity : 90%RH to 95%RH Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h4h.	It shall be soldered on the substrate.
Heat Life	Temperature : 125C3C Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h4h.	It shall be soldered on the substrate.
Cold Resistance	Temperature : -552C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h4h.	It shall be soldered on the substrate.